IP Library Granted Patent US 9,117,976
Granted Patent B2
US 9,117,976 · App. 14/074,091 · Granted Aug 25, 2015

Flexible light-emitting device

Inventors: Kaoru Hatano (Atsugi, JP); Satoshi Seo (Kawasaki, JP); Takaaki Nagata (Atsugi, JP); Tatsuya Okano (Atsugi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L33/48H01L27/1214H01L27/1266H01L51/0097H01L51/5237H01L27/1225H01L27/3244H01L2251/5338H01L2251/558Y02E10/549
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Quick Facts
Patent No.
US 9,117,976
App. No.
14/074,091
Granted
Aug 25, 2015
Kind
B2
Abstract

It is an object to provide a flexible light-emitting device with long lifetime in a simple way and to provide an inexpensive electronic device with long lifetime using the flexible light-emitting device. A flexible light-emitting device is provided, which includes a substrate having flexibility and a light-transmitting property with respect to visible light; a first adhesive layer over the substrate; an insulating film containing nitrogen and silicon over the first adhesive layer; a light-emitting element including a first electrode, a second electrode facing the first electrode, and an EL layer between the first electrode and the second electrode; a second adhesive layer over the second electrode; and a metal substrate over the second adhesive layer, wherein the thickness of the metal substrate is 10 μm to 200 μm inclusive. Further, an electronic device using the flexible light-emitting device is provided.

Claims (55)

1. A light-emitting device comprising:

a substrate having flexibility;

an adhesive;

an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon;

a light-emitting element over the insulating film;

a layer capable of preventing entry of moisture over the light-emitting element; and

a second adhesive between the light-emitting element and the layer capable of preventing entry of moisture,

wherein the adhesive is provided between the light-emitting element and the substrate having flexibility,

wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and

wherein the light-emitting element comprises:

a first electrode;

a second electrode over the first electrode; and

an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound.

2. The light-emitting device according to claim 1 , wherein the layer capable of preventing entry of moisture is a metal substrate.

3. The light-emitting device according to claim 1 , wherein the substrate having flexibility is capable of transmitting visible light.

4. The light-emitting device according to claim 1 , wherein the substrate having flexibility is a plastic substrate.

5. An electronic device comprising the light-emitting device according to claim 1 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing.

6. A light-emitting device comprising:

a substrate having flexibility;

an adhesive;

an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon;

a light-emitting element over the insulating film;

a metal capable of preventing entry of moisture over the light-emitting element; and

a second adhesive between the light-emitting element and the metal capable of preventing entry of moisture,

wherein the adhesive is provided between the light-emitting element and the substrate having flexibility,

wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and

wherein the light-emitting element comprises:

a first electrode;

a second electrode over the first electrode; and

an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound.

7. The light-emitting device according to claim 6 , wherein the metal capable of preventing entry of moisture is a metal substrate.

8. The light-emitting device according to claim 6 , wherein the substrate having flexibility is capable of transmitting visible light.

9. The light-emitting device according to claim 6 , wherein the substrate having flexibility is a plastic substrate.

10. An electronic device comprising the light-emitting device according to claim 6 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing.

11. A light-emitting device comprising:

a substrate having flexibility;

an adhesive;

an insulating film over the substrate having flexibility, the insulating film comprising nitrogen and silicon;

a light-emitting element over the insulating film;

a transistor over the insulating film, the transistor is electrically connected to the light-emitting element;

a layer capable of preventing entry of moisture over the light-emitting element; and

a second adhesive between the light-emitting element and the layer capable of preventing entry of moisture,

wherein the adhesive is provided between the light-emitting element and the substrate having flexibility,

wherein the insulating film is provided between the substrate having flexibility and the light-emitting element, and

wherein the light-emitting element comprises:

a first electrode;

a second electrode over the first electrode; and

an electroluminescence layer interposed between the first electrode and the second electrode, the electroluminescence layer comprising an organic compound.

12. The light-emitting device according to claim 11 ,

wherein the transistor comprises a semiconductor layer and a gate electrode which overlap with each other,

wherein the semiconductor layer comprises polysilicon.

13. The light-emitting device according to claim 11 , wherein the layer capable of preventing entry of moisture is a metal substrate.

14. The light-emitting device according to claim 11 , wherein the substrate having flexibility is capable of transmitting visible light.

15. The light-emitting device according to claim 11 , wherein the substrate having flexibility is a plastic substrate.

16. An electronic device comprising the light-emitting device according to claim 11 , the electronic device comprising at least one of a FPC, an IC chip, a printed wiring board, and a housing.

Priority Claims (2)
JP 2008-267774 · Oct 16, 2008 · national
JP 2009-123451 · May 21, 2009 · national
Continuity (3)
Continuation 13480693 · May 25, 2012
Continuation 12578687 · Oct 14, 2009
Related Publication 20140124796A1 · May 8, 2014