Method of cutting flexible display device and method of fabricating flexible display device using the same
The present disclosure relates to a method of cutting a flexible display device, capable of preventing a generation of a defect at the time of cutting the flexible display device, the method including providing a glass mother substrate having a flexible substrate attached thereon and an insulating layer formed on the flexible substrate; melting the flexible substrate and the insulating layer on the mother substrate by irradiating with a first laser beam; and cutting the mother substrate exposed by the irradiation of the first laser beam using a cutting device.
1. A method of cutting a flexible display device comprising:
providing a mother substrate having a flexible substrate attached thereon and an insulating layer formed on the flexible substrate;
melting the flexible substrate and the insulating layer on the mother substrate by irradiating with a first laser beam thereby exposing a portion of the mother substrate; and
cutting the mother substrate along the portion exposed by the irradiation of the first laser beam using a second laser,
wherein the first laser and the second laser are disposed adjacent to each other so that the first laser and the second laser are active simultaneously such that the first laser exposes the mother substrate, and the adjacent second laser cuts the mother substrate.
2. The method of claim 1 , wherein the first laser comprises an AN-YAG laser.
3. The method of claim 1 , wherein the second laser includes a CO2 laser.
4. The method of claim 1 , wherein the second laser irradiates a laser beam onto the mother substrate a plurality of times.
5. The method of claim 1 , wherein the flexible substrate is made of polyimide.
6. A method of fabricating an organic light emitting display (OLED) device comprising:
providing a mother substrate having a plurality of panel regions;
attaching a flexible substrate onto each panel region of the mother substrate, the flexible substrate having a display part and an outer part at the outside of the display part;
forming an organic light emitting structure on the display part of the flexible substrate;
melting the flexible substrate between the adjacent panel regions of the mother substrate by irradiating a laser beam thereto thereby exposing the portions of the mother substrate between the adjacent panel regions;
cutting the mother substrate exposed by the irradiation of the first laser beam using a second laser, wherein the first laser and the second laser are disposed adjacent to each other so that the first laser and the second laser are active simultaneously such that the first layer exposes the mother substrate, and the adjacent second laser cuts the mother substrate; and
separating the mother substrate from the flexible substrate.
7. The method of claim 6 , wherein the forming of the organic light emitting structure comprises:
forming a thin film transistor on each pixel;
forming a first electrode on each pixel;
forming an organic light emitting unit on the first electrode, the organic light emitting unit configured to emit light; and
forming a second electrode on the organic light emitting unit.
8. The method of claim 6 , wherein the flexible substrate is made of a plastic material.
9. The method of claim 6 , wherein the separating of the mother substrate from the flexible substrate comprises irradiating with the first laser beam onto a rear surface of the mother substrate.
10. The method of claim 6 , further comprising forming at least one passivation layer on the display part and the outer part of the panel region.
11. The method of claim 10 , wherein the passivation layer is melted by the first laser beam.
12. The method of claim 1 , wherein the mother substrate is made of glass.