IP Library Granted Patent US 9,188,605
Granted Patent B2
US 9,188,605 · App. 14/078,364 · Granted Nov 17, 2015

Integrated circuit (IC) test socket with Faraday cage

Inventor: Victor Landa (Ladera Ranch, CA)
Assignee: Xcerra Corporation
G01R1/0466G01R1/18G01R31/2886G01R31/2889
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Quick Facts
Patent No.
US 9,188,605
App. No.
14/078,364
Granted
Nov 17, 2015
Kind
B2
Abstract

An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing. The test socket base is grounded, and a ground current runs through the base and into conductive strips. The configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference. The compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip.

Claims (7)

1. A test socket for a microchip, comprising:

a base including a plurality of aligning through holes for securing the base to a handler, the base further comprising a chip test socket and a shield comprising four adjoining plates surrounding the test socket, each plate including a pair of edges aligned parallel to the test socket and a pair of edges aligned diagonally to the test socket;

wherein the shield is entirely disposed on top of the base and is sandwiched between the base and a clamp plate when placed in a tester; and

wherein the base, shield, and test socket are integrated as a single unit.

2. The test socket of claim 1 , wherein the shield is octagonal shaped.

3. The test socket of claim 1 , wherein the shield is made of a metal mesh.

4. The test socket of claim 1 , wherein the base and the shield form a Faraday cage about the microchip when the base is seated on a grounded circuit board.

Assignments (6)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
FIRST SUPPLEMENT TO INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Sep 17, 2015
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 036622/0065 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2015
From: TITAN SEMICONDUCTOR TOOL, LLC
To: XCERRA CORPORATION
Reel/Frame 035174/0687 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2013
From: LANDA, VICTOR
To: TITAN SEMICONDUCTOR TOOL, LLC
Reel/Frame 031588/0133 →
Continuity (1)
Related Publication 20150130487A1 · May 14, 2015