Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern.
1. A light-emitting apparatus comprising:
a ceramic package;
a conductive pattern formed on a mounting area of said ceramic package;
a light-emitting device mounted on the mounting area of said ceramic package, including an electrode provided on a bottom of said light-emitting device that faces said conductive pattern and is connected to said conductive pattern; and
a metal layer below the mounting area and buried in said ceramic package, a thickness between a top surface of said metal layer and a top surface of said ceramic package at the mounting area being smaller than a thickness between a bottom surface of said metal layer and a bottom surface of said ceramic package.
2. The light-emitting apparatus of claim 1 , further comprising a diode provided on said ceramic package and electrically connected to said light-emitting device.
3. The light-emitting apparatus of claim 2 , wherein said diode is a light-emitting diode.
4. The light-emitting apparatus of claim 2 , wherein said ceramic package contains alumina.
5. The light-emitting apparatus of claim 4 , wherein said light-emitting device is sealed with a transparent resin.
6. The light-emitting apparatus of claim 5 , wherein the electrode of said light-emitting device is connected to said conductive pattern with a conductive adhesive agent.
7. The light-emitting apparatus of claim 2 , wherein said ceramic package contains aluminum nitride.
8. A light-emitting apparatus comprising:
a ceramic package;
a conductive pattern formed on a mounting area of said ceramic package;
a light-emitting device mounted on the mounting area of said ceramic package, including an electrode provided on a bottom of said light-emitting device that faces said conductive pattern and is connected to said conductive pattern; and
a metal layer below the mounting area and buried in said ceramic package, a thickness between a top surface of said metal layer and the mounting area being smaller than a thickness between the top surface of said metal layer and a bottom surface of said ceramic package.
9. The light-emitting apparatus of claim 8 , further comprising a diode provided on said ceramic package and electrically connected to said light-emitting device.
10. The light-emitting apparatus of claim 9 , wherein said diode is a light-emitting diode.
11. The light-emitting apparatus of claim 9 , wherein said ceramic package contains alumina.
12. The light-emitting apparatus of claim 11 , wherein said light-emitting device is sealed with a transparent resin.
13. The light-emitting apparatus of claim 12 , wherein the electrode of said light-emitting device is connected to said conductive pattern with a conductive adhesive agent.
14. The light-emitting apparatus of claim 9 , wherein said ceramic package contains aluminum nitride.