Circuit module and method of producing the same

1. A circuit module, comprising:

a substrate having a mount surface;

a mount component mounted on the mount surface;

a sealing body having a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface;

a trench having a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench having two end portions adjacent to and spaced apart from the outer peripheral surface, the trench having an intermediate portion extending continuously along the mount surface from one end portion to the other end portion with the end portions being spaced apart from one another in a direction parallel to the sealing body main surface, the two end portions each having either a stepped configuration or a lower portion thereof that extends up toward the sealing body main surface in an inclined or a curved manner and being formed to be shallower than the intermediate portion of the trench extending between the two end portions, the intermediate portion having a constant depth; and

a shield having an external shield portion covering the main surface and the outer peripheral surface of the sealing body, and an internal shield portion being filled in the trench with the external shield portion along the outer peripheral surface being spaced from the internal shield portion in the two end portions of the trench.

2. The circuit module according to claim 1 , wherein

the mount component includes a plurality of mount components, and

the trench separates the plurality of mount components from each other.

3. The circuit module according to claim 1 , wherein

the trench end portions are shaped like a circular arc on the main surface.

4. The circuit module according to claim 1 , wherein the trench has opposite sides that extend between the trench end surfaces and up toward the sealing body main surface with the trench opposite sides being parallel to each other.

5. The circuit module according to claim 1 , wherein both the external and internal shield portions are of the same conductive material and have substantially the same thickness thereof.

6. The circuit module according to claim 1 , further comprising:

a surface layer conductor provided on the mount surface along the trench extending from the main surface to the surface layer conductor, the shield being connected to the surface layer conductor, and the surface layer conductor having two end portions adjacent to and spaced apart from the outer peripheral surface, the surface layer conductor extending continuously along the mount surface from one end portion to the other end portion.

7. A method of producing a circuit module, comprising:

mounting a mount component on a mount surface of a substrate;

providing a sealing body on the mount surface, the sealing body having a main surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface;

forming an outer peripheral surface on the sealing body provided on the mount surface by cutting the sealing body along an outline of the sealing body, the outer peripheral surface covering the mount component on the mount surface;

forming a trench on the sealing body provided on the mount surface, the trench being recessed from the main surface of the sealing body to the mount surface, the trench having two end portions adjacent to and spaced apart from the outer peripheral surface, the trench having an intermediate portion extending continuously along the mount surface from one end portion to the other end portion with the end portions spaced apart from one another in a direction parallel to the sealing body main surface, the two end portions each having either a stepped configuration or a lower portion thereof that extends up toward the sealing body main surface in an inclined or a curved manner and being formed to be shallower than the intermediate portion of the trench extending between the two end portions, the intermediate portion having a constant depth;

filling an internal shield portion of a shield in the trench after the outer peripheral surface and the trench are formed on the sealing body, the shield having an external shield portion covering the main surface and the outer peripheral surface of the sealing body with the external shield portion along the outer peripheral surface being spaced from the internal shield portion in the two end portions of the trench.

8. The method of producing a circuit module according to claim 7 including forming a surface layer conductor on the mount surface along the trench, the trench extending from the main surface to the surface layer conductor, and the surface layer conductor having two end portions adjacent to and spaced apart from the outer peripheral surface, the surface layer conductor extending continuously along the mount surface from one end portion to the other end portion with the internal shield portion being connected to the surface layer conductor.

9. The method of producing a circuit module according to claim 7 , wherein the trench is formed by laser processing.

10. The method of producing a circuit module according to claim 9 , wherein

output of a laser when the trench is formed is set to be lower at the end portions of the trench than at other portions of the trench.

11. The method of producing a circuit module according to claim 8 , wherein

the surface layer conductor is formed on the mount surface along the trench before the sealing body is provided on the mount surface.