IP Library › Assignment 059769/0319
Patent Assignment
Reel/Frame 059769/0319

Assignment of Assignor's Interest

Recorded: 2022-04-29 Pages: 4
Assignor
TAIYO YUDEN CO., LTD.
Executed: 2021-01-01
Assignee
KAGA FEI CO., LTD.
100-45, SHIN-YOKOHAMA 2-CHOME, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-8508, JAPAN
Covered Properties (19)
Circuit Module and Method of Producing the Same
Patent: 9,101,044 →
Application: 14/086,407 →
Publication: US 2015/0043170
Circuit Module
Patent: 9,055,682 →
Application: 14/086,472 →
Publication: US 2015/0043171
Circuit Module Having Electrical Shield
Patent: 9,101,050 →
Application: 14/090,387 →
Publication: US 2015/0049439
Circuit Module and Method of Producing Circuit Module
Patent: 9,456,488 →
Application: 14/090,445 →
Publication: US 2015/0070849
Circuit Module and Method of Producing the Same
Patent: 9,807,916 →
Application: 14/090,534 →
Publication: US 2015/0070851
Circuit Module and Method of Producing Circuit Module
Patent: 8,890,309 →
Application: 14/102,172 →
Circuit Module
Patent: 8,897,019 →
Application: 14/103,620 →
Circuit Module and Production Method Therefor
Patent: 9,455,209 →
Application: 14/148,240 →
Publication: US 2014/0293550
Circuit Module and Method of Producing Circuit Module
Patent: 9,018,039 →
Application: 14/517,424 →
Publication: US 2015/0044822
Circuit Module and Method of Manufacturing Same
Patent: 9,560,740 →
Application: 14/861,867 →
Publication: US 2016/0095267
Circuit Module
Patent: 9,894,816 →
Application: 15/115,868 →
Publication: US 2017/0013748
Wireless Module and Method for Manufacturing the Same
Application: 15/828,160 →
Publication: US 2018/0159216
Wireless Module and Method for Manufacturing Wireless Module
Application: 15/828,178 →
Publication: US 2018/0159209
Wireless Module and Method for Manufacturing Wireless Module
Application: 15/828,191 →
Publication: US 2018/0159217
Wireless Module and Method for Manufacturing the Same
Application: 15/832,405 →
Publication: US 2018/0166767
Electronic Component Module and Method of Manufacturing the Same
Application: 15/934,757 →
Publication: US 2018/0286796
Method of Manufacturing Electronic Component Module
Application: 15/935,829 →
Publication: US 2018/0286817
Method of Making Plural Electronic Component Modules
Application: 16/380,990 →
Publication: US 2019/0237409
Electronic Component Module
Application: 16/428,596 →
Publication: US 2019/0378802
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 21, 2013
From: SHIMAMURA, MASAYA; KITAZAKI, KENZO; NAGAI, YUTAKA; NAKAMURA, HIROSHI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031653/0183 →
Assignment of Assignor's Interest Nov 21, 2013
From: MUGIYA, EIJI; KITAZAKI, KENZO; SHIMAMURA, MASAYA
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031653/0316 →
Assignment of Assignor's Interest Nov 26, 2013
From: KITAZAKI, KENZO; SHIMAMURA, MASAYA; MUGIYA, EIJI; KAI, TAKEHIKO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031681/0479 →
Assignment of Assignor's Interest Nov 26, 2013
From: SHIMAMURA, MASAYA; KAI, TAKEHIKO; MUGIYA, EIJI; SAJI, TETSUO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031681/0374 →
Assignment of Assignor's Interest Nov 26, 2013
From: SHIMAMURA, MASAYA; KITAZAKI, KENZO; MUGIYA, EIJI; SAWATARI, TATSURO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031681/0178 →
Assignment of Assignor's Interest Dec 10, 2013
From: MUGIYA, EIJI; KAI, TAKEHIKO; SHIMAMURA, MASAYA; SAJI, TETSUO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031753/0962 →
Assignment of Assignor's Interest Dec 11, 2013
From: SHIMAMURA, MASAYA; KITAZAKI, KENZO; MUGIYA, EIJI; SAJI, TETSUO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 031763/0133 →
Assignment of Assignor's Interest Oct 17, 2014
From: MUGIYA, EIJI; KAI, TAKEHIKO; SHIMAMURA, MASAYA; SAJI, TETSUO
To: TAIYO YUDEN CO., LTD
Reel/Frame 033974/0702 →
Assignment of Assignor's Interest Jul 21, 2015
From: MUGIYA, EIJI; SHIMAMURA, MASAYA; KITAZAKI, KENZO; KAI, TAKEHIKO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 036140/0164 →
Assignment of Assignor's Interest Sep 30, 2015
From: KITAZAKI, KENZO; MUGIYA, EIJI; SHIMAMURA, MASAYA
To: TAIYO YUDEN CO., LTD.
Reel/Frame 036698/0573 →
Assignment of Assignor's Interest Sep 20, 2016
From: SAJI, TETSUO; ICHIKAWA, YOHEI; NAKAMURA, HIROSHI
To: YAIYO YUDEN CO., LTD.
Reel/Frame 040088/0425 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 040088 Frame: 0425. Assignor(S) Hereby Confirms the Assignment. Oct 25, 2017
From: SAJI, TETSUO; ICHIKAWA, YOHEI; NAKAMURA, HIROSHI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 044286/0768 →
Assignment of Assignor's Interest Feb 27, 2018
From: MIKATA, JIN; SHIMAMURA, MASAYA; AOKI, MIKIO; KAI, TAKEHIKO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045054/0407 →
Assignment of Assignor's Interest Feb 27, 2018
From: KAI, TAKEHIKO; SHIMAMURA, MASAYA; AOKI, MIKIO; MIKATA, JIN
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045054/0052 →
Assignment of Assignor's Interest Feb 27, 2018
From: MIKATA, JIN; SHIMAMURA, MASAYA; AOKI, MIKIO; KAI, TAKEHIKO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045054/0428 →
Assignment of Assignor's Interest Feb 27, 2018
From: ITO, TAIJI; MIKATA, JIN
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045054/0143 →
Assignment of Assignor's Interest Apr 9, 2018
From: KITAZAKI, KENZO; KAI, TAKEHIKO; SHIMAMURA, MASAYA; AOKI, MIKIO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045483/0258 →
Assignment of Assignor's Interest Apr 9, 2018
From: KITAZAKI, KENZO; KAI, TAKEHIKO; SHIMAMURA, MASAYA; AOKI, MIKIO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 045483/0220 →
Assignment of Assignor's Interest May 31, 2019
From: KITAZAKI, KENZO; KAI, TAKEHIKO; SHIMAMURA, MASAYA; AOKI, MIKIO
To: TAIYO YUDEN CO., LTD.
Reel/Frame 049339/0036 →
Change of Address Apr 29, 2022
From: TAIYO YUDEN CO., LTD.
To: TAIYO YUDEN CO., LTD.
Reel/Frame 059821/0919 →