Electronic component module and method of manufacturing the same
An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.
1. An electronic component module comprising:
a substrate including a conductive pattern;
an electronic component provided to the substrate;
a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion;
a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion;
a removal portion having a shape formed by removing the edge portion formed by the upper surface and the side surface of the sealing portion after the upper surface and the side surface of the sealing portion are exposed to an exterior to form the edge portion so that the removal portion eliminates the edge portion but leaves remaining portions of the upper surface and the side surface intact; and
a shielding film covering the remaining portions of the upper surface and the side surface, a surface formed by the removal portion, and the contact portion of the sealing portion
wherein the contact portion is configured to be electrically connected with the conductive pattern, and has the vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface, and
wherein an electrode of the contact portion includes a solid ground.
2. An electronic component module according to claim 1 , wherein the removal portion is formed above the electronic component.
3. An electronic component module according to claim 1 , wherein
the substrate is a silicon interposer, and
a conductive pattern is formed, in an upper layer of a Si substrate, and is subjected to an insulating process using an inorganic insulation film.
4. An electronic component module according to claim 1 , wherein the removal portion is formed on a side surface opposite to a side surface where the contact portion is formed.
5. An electronic component module according to claim 1 , wherein
the contact portion includes at least one of
an electrode provided to a surface layer or an inner layer of the substrate,
a via provided so as to connect between the electrode and a layer thereabove or a layer therebelow, or between the layers, or
a through hole provided to an upper layer or a lower layer with respect to the electrode.
6. An electronic component module according to claim 5 , wherein
the via includes a plurality of vias and the through hole includes a plurality of through holes, and
the plurality of vias or through holes is provided at random or provided in a row, in a portion corresponding to the side surface of the sealing portion.
7. An electronic component module according to claim 1 , wherein the contact portion includes a curved surface between the vertical surface and the horizontal surface.
8. An electronic component module according to claim 7 , wherein
t1>t3, and
t2>t3 or t4>t3,
where t1 is a film thickness of the shielding film in the upper surface of the sealing portion, t2 is a film thickness of the shielding film in the horizontal surface of the contact portion, t3 is a film thickness of the shielding film in the side surface of the sealing portion, and t4 is a film thickness of the shielding film in the curved surface of the contact portion.
9. An electronic component module, comprising:
a substrate including a conductive pattern;
an electronic component provided to the substrate;
a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion;
a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion;
a removal portion formed by removing the edge portion formed by the upper surface and the side surface of the sealing portion; and
a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion,
wherein:
the substrate is provided with the conductive pattern, the substrate including a wireless region, where the electronic component is disposed, and an antenna region, where a wiring pattern serving as an antenna is disposed,
the electronic component is configured to be electrically connected with the conductive pattern, and is a wireless circuit component provided in the wireless region, and
the removal portion is positioned above the antenna region.
10. An electronic component module according to claim 9 , wherein the removal portion is formed above the electronic component.
11. An electronic component module according to claim 9 , wherein
the contact portion is configured to be electrically connected with the conductive pattern, and
the contact portion includes at least one of
an electrode provided to a surface layer or an inner layer of the substrate,
a via provided so as to connect between the electrode and a layer thereabove or a layer therebelow, or between the layers, or
a through hole provided to an upper layer or a lower layer with respect to the electrode.
12. An electronic component module according to claim 9 , wherein the removal portion is formed on a side surface opposite to a side surface where the contact portion is formed.
13. An electronic component module according to claim 9 , wherein the contact portion is configured to be electrically connected with the conductive pattern, and has the vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface.
14. An electronic component module according to claim 13 , wherein the contact portion includes a curved surface between the vertical surface and the horizontal surface.
15. An electronic component module according to claim 14 , wherein:
t1>t3, and
t2>t3 or t4>t3,
where t1 is a film thickness of the shielding film in the upper surface of the sealing portion, t2 is a film thickness of the shielding film in the horizontal surface of the contact portion, t3 is a film thickness of the shielding film in the side surface of the sealing portion, and t4 is a film thickness of the shielding film in the curved surface of the contact portion.
16. A method of manufacturing an electronic component module, including
preparing a second insulating substrate formed such that a plurality of component mounting regions, where electronic components are disposed, is disposed on a first insulating substrate, the second insulating substrate including a dicing region between the component mounting regions adjacent to each other, and a sealing portion covering, with an insulating material, a surface where the electronic component is provided,
forming a first groove in the dicing region, to form a side surface of the sealing portion so as to surround the component mounting regions,
forming a shielding film by forming a film, using a conductive material, on an upper surface and the side surface of the sealing portion in a vacuum atmosphere lower than an atmospheric pressure, and
separating the second insulating substrate at the dicing region,
the method comprising:
forming the first groove, through the sealing portion, in the first insulating substrate so as to expose a side surface of the first insulating substrate;
forming a second groove formed on the upper surface of the sealing portion so as to be continuous with the first groove, the second groove having a width greater than and having a depth shallower than the first groove; and
forming the shielding film on the side surface of the first insulating substrate such that the conductive material is allowed to pass through the second groove in the low vacuum atmosphere.
17. A method of manufacturing an electronic component module according to claim 16 , wherein the conductive material is formed by vapor deposition, sputtering or CVD.
18. A method of manufacturing an electronic component module according to claim 16 , wherein
the second groove is formed such that a length of the side surface from a bottom surface of the first groove to a bottom surface of the second groove is twice or smaller with respect to a width of the first groove.