Circuit module and method of manufacturing same
A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
1. A circuit module, comprising:
a substrate having a plurality of electronic components mounted thereon, said substrate further having a conductive pattern that defines respective shielded areas where the electronic components are mounted;
a sealing layer covering the substrate and the electronic components, said sealing layer having grooves formed therein along said conductive pattern; and
a conductive shield, including:
a first shielding section covering a top surface of the sealing layer;
a second shielding section covering side faces of the sealing layer; and
a third shielding section filling the grooves in the sealing layer,
wherein the grooves in the sealing layer are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.
2. The circuit module according to claim 1 , wherein said at least one end of the third shielding section is bent into an “L” shape.
3. The circuit module according to claim 1 , wherein said at least one end of the third shielding section is bent into a “T” shape.
4. The circuit module according to claim 1 , wherein said at least one end of the third shielding section is bent into an elliptical shape or semi-circular shape.
5. A method of manufacturing a circuit module, comprising:
preparing a substrate having a plurality of electronic components mounted thereon, said substrate further having a conductive pattern that defines respective shielded areas where the electronic components are mounted,
forming a sealing layer so as to cover the substrate and the electronic components;
forming, along the conductive pattern, grooves in the sealing layer having a depth that reaches the conductive pattern by irradiating a surface of said sealing layer with a laser beam; and
thereafter, applying a conductive resin on the sealing layer so as to form:
a first shielding section made of the conductive resin, covering a top surface of the sealing layer;
a second shielding section made of the conductive resin, covering side faces of the sealing layer; and
a third shielding section made of the conductive resin, filling the grooves in the sealing layer,
wherein in the step of forming the grooves, the grooves are shaped such that the third shielding section that fills the grooves has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.