Electronic component module
An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.
1. An electronic component module comprising:
a substrate;
electronic components mounted on the substrate, each of the electronic components having terminals located on a side surface, an upper surface, and/or a lower surface thereof; and
a shield located on the substrate so as to cover the electronic components, the shield having an upper plate and one or more side plates, the shield being supplied with a ground potential, the upper plate being located above the electronic components, the one or more side plates extending from the upper plate toward the substrate and surrounding the electronic components,
wherein in an electronic component closest to one side plate of the one or more side plates among one or more electronic components, in each of which at least two terminals of the terminals are located on the side surface and/or the upper surface, of the electronic components, a first distance of a first terminal, to which the ground potential is supplied, to the one side plate is shortest among the at least two terminals, and a second distance of one or more second terminals, to which the ground potential is not supplied, of the at least two terminals to the one side plate is greater than the first distance,
wherein the first distance is less than a vertical distance between the substrate and the upper plate.
2. The electronic component module according to claim 1 , wherein in each of at least first two electronic components in an order of closest to the one side plate among the one or more electronic components, the first distance of the first terminal, to which the ground potential is supplied, to the one side plate is shortest among the at least two terminals, and the second distance of each of the one or more second terminals to the one side plate is greater than the first distance.
3. The electronic component module according to claim 1 , wherein
distances between at least two electronic components including the electronic component closest to the one side plate of the one or more electronic components and the one side plate are approximately equal to each other,
in each of the at least two electronic components, the first distance of the first terminal, to which the ground potential is supplied, to the one side plate is shortest among the at least two terminals, and the second distance of each of the one or more second terminals to the one side plate is greater than the first distance.
4. The electronic component module according to claim 1 , wherein
each of the electronic components is a discrete component that is a capacitor, an inductor, or a resistor.
5. The electronic component module according to claim 1 , wherein
the first terminals and the second terminals are exposed to both end portions of the electronic components.
6. The electronic component module according to claim 1 , wherein
the electronic components are included in an electronic circuit that transmits a high-frequency signal to an antenna or receives a high-frequency signal from the antenna.
7. The electronic component module according to claim 1 , wherein
the one side plate and the electronic component closest to the one side plate face each other across an air gap.
8. The electronic component module according to claim 1 , wherein
the shield is fixed to the substrate only by three fixing portions, a side plate other than the three fixing portions and the substrate are located away from each other, and
the one side plate is the side plate other than the three fixing portions.
9. The electronic component module according to claim 8 , wherein
a planar shape of the shield is a substantially rectangular shape, and
one of the three fixing portions is located in a middle part of a first side of the substantially rectangular shape, and other two of the three fixing portions are located in both ends of a second side facing the first side.