IP Library Granted Patent US 9,018,039
Granted Patent B2
US 9,018,039 · App. 14/517,424 · Granted Apr 28, 2015

Circuit module and method of producing circuit module

Inventors: Eiji Mugiya (Tokyo, JP); Takehiko Kai (Tokyo, JP); Masaya Shimamura (Tokyo, JP); Tetsuo Saji (Tokyo, JP); Hiroshi Nakamura (Tokyo, JP)
Assignee: Taiyo Yuden Co., Ltd.
H01L23/552H01L21/56H01L21/52
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Quick Facts
Patent No.
US 9,018,039
App. No.
14/517,424
Granted
Apr 28, 2015
Kind
B2
Abstract

A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

Claims (7)

1. A method of producing a circuit module, comprising:

mounting mount components including an RF (Radio Frequency) component configuring an RF circuit on a mount surface of a circuit substrate,

forming a sealing body for covering the mount component on the mount surface having a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness, the first sealing body section covering the RF component and not covering the mount component having a highest mount height from the mount surface among the mount components, the first thickness being smaller than the highest mount height of the mount component, the second sealing body section covering the mount component having the highest mount height from the mount surface among the mount components, and the second thickness being larger than the highest mount height of the mount component,

forming a shield by coating a shielding material to form a plane parallel to the mount surface.

2. The method of producing a circuit module according to claim 1 , further comprising:

forming a trench surrounding the RF component on the sealing body; and

filling the trench with the shielding material to form an inner shield.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2022
From: TAIYO YUDEN CO., LTD.
To: KAGA FEI CO., LTD.
Reel/Frame 059769/0319 →
CHANGE OF ADDRESS Recorded Apr 29, 2022
From: TAIYO YUDEN CO., LTD.
To: TAIYO YUDEN CO., LTD.
Reel/Frame 059821/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2014
From: MUGIYA, EIJI; KAI, TAKEHIKO; SHIMAMURA, MASAYA; SAJI, TETSUO; NAKAMURA, HIROSHI
To: TAIYO YUDEN CO., LTD
Reel/Frame 033974/0702 →
Priority Claims (1)
JP 2013-165378 · Aug 8, 2013 · national
Continuity (2)
Division 14102172 · Dec 10, 2013
Related Publication 20150044822A1 · Feb 12, 2015