Circuit module and method of producing the same
A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
1. A circuit module, comprising:
a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having a first area and a second area, the conductor pattern being formed along a boundary between the first area and the second area on the mount surface, the insulating protective layer being formed on the whole area of the mount surface, the conductor pattern including a first metal layer and a second metal layer having a laser reflectance property higher than that of the first metal layer being formed on a surface of the first metal layer, the insulating protective layer covering the mount surface and the conductor pattern;
a plurality of electronic components mounted on the first area and the second area;
an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components and the protective layer, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductor pattern; and
a conductive shield having a first shield portion and a second shield portion, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.
2. The circuit module according to claim 1 , wherein
the protective layer has a first thickness right above the conductor pattern,
the sealing layer has a second thickness right above the conductor pattern, and
the trench has a depth equal to a sum of the first thickness and the second thickness.
3. The circuit module according to claim 1 , wherein
an inner peripheral wall surface of the trench has
a first inner peripheral wall surface including a material of the sealing layer, and
a second inner peripheral wall surface including a material of the protective layer.
4. The circuit module according to claim 1 , wherein
the first metal layer includes Cu, and
the second metal layer includes one of Au and Ag.
5. The circuit module according to claim 4 , wherein
the conductor pattern further has a third metal layer disposed between the first metal layer and the second metal layer, and
the third metal layer includes a metal material having a melting point higher than Cu.
6. The circuit module according to claim 1 , wherein
the trench is formed by laser processing.
7. The circuit module according to claim 1 , wherein
the sealing layer includes a resin material containing a filler.