CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization. Each insert of the component includes: a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and a metal layer substantially only covering the internal surface of the metal core.
1 . A method of manufacturing an electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization,
wherein the method comprises, for each insert:
forming a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and
forming a metal layer substantially only covering the internal surface of the metal core and intended to be in contact with the pad associated with the insert;
and wherein the metal layer is made of an inoxidizable metal, especially a noble metal, or wherein the forming of the metal layer comprises:
forming a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least said non-oxidized portion of the internal surface of the core, the first sub-layer having a greater plasticity than the core; and
fouling a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer.
2 . The method of claim 1 , wherein the first sub-layer is made of an oxidizable metal and wherein the second sub-layer is made by oxidizing the first sub-layer to create a layer of native oxide of the metal forming the first sub-layer having a plasticity lower than that of the first sub-layer.
3 . The method of claim 2 , wherein the first sub-layer is made of aluminum, the second sub-layer being an aluminum oxide.
4 . The method of claim 1 , wherein the hollow metal core is made of a hard metal, particularly of titanium nitride, of tungsten nitride, of copper, of vanadium, of molybdenum, of nickel, of titanium tungstenate, of WSi, and/or of tungsten.
5 . The method of claim 1 , wherein the adherence of the second sub-layer to the first sub-layer is low so that the second sub-layer slides on the first sub-layer under the effect of a shearing applied to the stack of the first and second sub-layers.
6 . The method of claim 1 , wherein the first sub-layer has a ductility substantially equal to that of the pads.
7 . A method of face-to-face type hybridization of a microelectronic component obtained according to the method of any of the foregoing claims with a micro-electronic component having on one of its surfaces respective ductile conductive pads having a lower hardness than the metal core of the hollow inserts, comprising the insertion at ambient temperature of the inserts, provided with their second metal sub-layer, into the pads.
8 . The method of claim 7 , wherein the interconnect pitch between microcomponents is smaller than 10 micrometers.