Semiconductor light emitting device and method for manufacturing the same

1. A semiconductor light emitting device comprising:

a first conductive layer;

a first semiconductor layer of a first conductivity type;

a second semiconductor layer of a second conductivity type, the second semiconductor layer being provided between the first conductive layer and the first semiconductor layer;

a light emitting part provided between the first semiconductor layer and the second semiconductor layer; and

a second conductive layer being in contact with the second semiconductor layer and the first conductive layer, the second conductive layer being provided between the second semiconductor layer and the first conductive layer,

the first conductive layer including a first polycrystal having first grain boundaries, the first conductive layer being transmittable with respect to light emitted from the light emitting part,

the second conductive layer including a second polycrystal having second grain boundaries, the second conductive layer being transmittable with respect to the light,

an average of first distances between the first grain boundaries being greater than an average of second distances between the second grain boundaries, and

the average of the second distances being 150 nanometers or less.

2. The device according to claim 1 , wherein

a thickness of the second conductive layer is 100 nanometers or less.

3. The device according to claim 1 , wherein

sum of a thickness of the first conductive layer and the thickness of the second conductive layer is one of more than 150 nanometers and 200 nanometers or less and 260 nanometers or more and 330 nanometers or less.

4. The device according to claim 1 , wherein

the first conductive layer and the second conductive layer include an oxide including at least one of elements selected from the group of In, Sn, Zn, and Ti.

5. The device according to claim 1 , further comprising a third conductive layer having transmittance to the light lower than transmittance of the first conductive layer and lower than transmittance of the second conductive layer,

the first conductive layer including:

a first portion in contact with the third conductive layer and the second semiconductor layer between the third conductive layer and the second semiconductor layer; and

a second portion not covered with the third conductive layer and covering at least a part of the second conductive layer.

6. The device according to claim 5 , wherein the third conductive layer is a metal layer.

7. The device according to claim 1 , wherein a thickness of the second conductive layer is less than a thickness of the first conductive layer.

8. The device according to claim 1 , wherein a thickness of the second conductive layer is 50 nanometers or less.

9. The device according to claim 1 , wherein a thickness of the first conductive layer is 50 nanometers or more and 400 nanometers or less.

10. The device according to claim 1 , wherein the average of the first distances is 150 nanometers or more and 1 micrometers or less.

11. The device according to claim 1 , wherein the average of the second distances is 10 nanometers or more.