Heat spreader with flexible tolerance mechanism

1. A semiconductor device packaging system comprising:

a substrate;

a heat spreader;

a ring-shaped stiffener attached to the substrate;

at least one die electrically coupled to the substrate and thermally coupled to the heat spreader;

at least one stud coupled to one of the ring-shaped stiffener and the heat spreader; and

at least one orifice formed through one of the ring-shaped stiffener and the heat spreader, the at least one orifice aligned with the at least one stud;

wherein the ring-shaped stiffener and the heat spreader are in direct contact with each other or have an air gap disposed therebetween.

2. The system of claim 1 further comprising an interposer electrically coupled to the substrate, wherein the interposer is displaced between the substrate and the at least one die.

3. The system of claim 2 wherein the interposer provides power connectivity and signal connectivity between the substrate and the at least one die.

4. The system of claim 2 wherein the interposer is one of a passive circuit device and an active circuit device.

5. The system of claim 1 wherein the at least one stud and the at least one orifice enables alignment of the heat spreader, the ring-shaped stiffener, and the least one die; and

a thermal interface material is disposed between the at least one die and the heat spreader.

6. The system of claim 5 wherein the thermal interface material is compressed between the at least one die and the heat spreader.

7. The system of claim 1 wherein the at least one stud includes a plated layer, wherein the plated layer establishes a bond between the at least one stud and the heat spreader when subjected to a heating process.

8. The system of claim 7 wherein the plated layer can be one of a two-phase material and a liquid metal material.

9. The system of claim 1 wherein the at least one die is at least one of a high power device and a low power device.

10. The system of claim 1 wherein the at least one die comprises a plurality of dies, wherein at least one of the plurality of dies is a high power device and at least another of the plurality of dies is a low power device.

11. A method of assembling a semiconductor device package comprising:

electrically coupling at least one die with a substrate;

coupling a ring-shaped stiffener to the substrate;

coupling at least one stud to one of the ring-shaped stiffener and a heat spreader;

forming at least one orifice through one of the ring-shaped stiffener and the heat spreader;

aligning the at least one stud with the at least one orifice to align the heat spreader, the ring-shaped stiffener, and the at least one die; and

thermally coupling the heat spreader with the at least one die;

wherein, in aligning the heat spreader, the ring-shaped stiffener, and the at least one die, the ring-shaped stiffener and the heat spreader are positioned so as to be in direct contact with each other or have an air gap disposed therebetween.

12. The method of claim 11 further comprising inserting an interposer between the at least one die and the substrate.

13. The method of claim 11 further comprising disposing a thermal interface material between the at least one die and the heat spreader.

14. The method of claim 11 further comprising applying a plated layer to the at least one stud.

15. The method of claim 14 further comprising heating the at least one stud, the plated layer, and the orifice to establish a bond between the at least one stud and the at least one orifice.

16. A flexible tolerance heat spreader for use with a semiconductor device package, the flexible tolerance heat spreader comprising:

at least one support path formed therethrough;

wherein the at least one support path interacts with at least one stud coupled to a metal ring of the semiconductor device package;

wherein the flexible tolerance heat spreader is variably positioned along a direction of the interaction of the at least one support path and the at least one stud to establish guidance of the fleixble tolerance heat spreader to provide thermal contact with at least one die of the substrate; and

wherein the flexible tolerance heat spreader is in direct contact with the metal ring of the semiconductor device package or separated from the metal ring of the semiconductor device package by an air gap disposed therebetween.

17. The flexible tolerance heat spreader of claim 16 wherein a thermal interface material initiates thermal contact between the flexible tolerance heat spreader and the at least one die of the substrate.

18. The flexible tolerance heat spreader of claim 17 wherein the thermal interface material is deformed when the flexible tolerance heat spreader and the at least one die of the substrate are placed in thermal contact.

19. The flexible tolerance heat spreader of claim 16 wherein the at least one stud has a plated layer.

20. The flexible tolerance heat spreader of claim 19 wherein the plated layer of the at least one stud establishes a bond between the at least one stud and the flexible tolerance heat spreader when heated.

21. The flexible tolerance heat spreader of claim 20 wherein the plated layer can be one of a two-phase material and a liquid metal material.