Reliable interconnect for semiconductor device
A method for forming a semiconductor device is presented. A substrate prepared with a dielectric layer formed thereon is provided. A sacrificial and a hard mask layer are formed on the dielectric layer. The dielectric, sacrificial and hard mask layers are patterned to form an interconnect opening. The interconnect opening is filled with a conductive material to form an interconnect. The conductive material is processed to produce a top surface of the conductive material that is substantially planar with a top surface of the sacrificial layer. The sacrificial layer is removed. The sacrificial layer protects the dielectric layer during processing of the conductive material.
1. A semiconductor device comprising:
a substrate;
a lower dielectric layer on the substrate, wherein the lower dielectric layer comprises at least an interconnect region and a non-interconnect region adjacent to the interconnect region, wherein the interconnect region of the lower dielectric layer comprises an interconnect disposed therein while the non-interconnect region of the lower dielectric layer is devoid of an interconnect and comprises an unetched or unpolished top surface having hydrophobic characteristics;
an etch stop layer disposed on and contacting the unetched or unpolished top surface of the non-interconnect region of the lower dielectric layer, wherein the same etch stop layer is also disposed over and contacts a top surface of the interconnect; and
an upper dielectric layer disposed on the etch stop layer.
2. The semiconductor device of claim 1 wherein the lower dielectric layer comprises low k or ultra low k dielectric material.
3. The semiconductor device of claim 2 wherein the lower dielectric layer comprises organo-silicate glass (OSG), fluorine-doped silicate glass (FSG), SiCOH, silicon oxide, doped silicon oxide, undoped or doped silicate glasses, undoped or doped thermally grown silicon oxide, or undoped or doped TEOS deposited silicon oxide.
4. The semiconductor device of claim 1 wherein the interconnect comprises a dual damascene structure having a conductive line disposed in an upper portion of the lower dielectric layer and a contact disposed in a lower portion of the lower dielectric layer.
5. The semiconductor device of claim 4 wherein the contact couples the conductive line to a contact region below the interconnect.
6. The semiconductor device of claim 5 wherein the contact region comprises another conductive line or a device region which includes a diffusion region or a gate of a transistor or a plate of a capacitor.
7. The semiconductor device of claim 1 wherein the interconnect comprises a damascene structure having a via contact disposed within the lower dielectric layer.
8. The semiconductor device of claim 1 wherein the top surface of the lower dielectric layer is below a top surface of the interconnect.
9. The semiconductor device of claim 1 wherein the interconnect comprises a protective capping layer over a top surface of the interconnect.
10. The semiconductor device of claim 9 wherein the capping layer is a conductive capping layer.
11. The semiconductor device of claim 10 wherein the conductive capping layer comprises CoWP.
12. The semiconductor device of claim 9 wherein the top surface of the non-interconnect region of the lower dielectric layer is disposed below a top surface of the capping layer.
13. The semiconductor device of claim 1 wherein the etch stop layer comprises silicon nitride.
14. A semiconductor device comprising:
a substrate;
a lower dielectric layer on the substrate, wherein the lower dielectric layer comprises at least an interconnect region and a non-interconnect region adjacent to the interconnect region, wherein the interconnect region of the lower dielectric layer comprises an interconnect disposed therein while the non-interconnect region of the lower dielectric layer is devoid of an interconnect and comprises an unetched or unpolished top surface having hydrophobic characteristics; and
an upper dielectric layer disposed over and contacting the unetched or unpolished top surface of the non-interconnect region of the lower dielectric layer and wherein the same upper dielectric layer is also disposed over and contacts a top surface of the interconnect.
15. A semiconductor device comprising:
a substrate;
a lower dielectric layer on the substrate, wherein the lower dielectric layer comprises at least an interconnect region and a non-interconnect region adjacent to the interconnect region, wherein the interconnect region of the lower dielectric layer comprises an interconnect disposed therein while the non-interconnect region of the lower dielectric layer is devoid of an interconnect and comprises an unetched or unpolished top surface having hydrophobic characteristics;
an etch stop layer disposed on and contacting the unetched or unpolished top surface of the non-interconnect region of the lower dielectric layer, wherein the same etch stop layer is also disposed over and contacts a top surface of the interconnect.
16. The semiconductor device of claim 15 wherein the interconnect comprises a dual damascene structure having a conductive line disposed in an upper portion of the lower dielectric layer and a contact disposed in a lower portion of the lower dielectric layer.
17. The semiconductor device of claim 16 wherein the contact couples the conductive line to a contact region below the interconnect.
18. The semiconductor device of claim 17 wherein the contact region comprises another conductive line or a device region which includes a diffusion region or a gate of a transistor or a plate of a capacitor.
19. The semiconductor device of claim 15 wherein the interconnect comprises a damascene structure having a via contact disposed within the lower dielectric layer.
20. The semiconductor device of claim 15 wherein the interconnect comprises a protective capping layer over a top surface of the interconnect.