IP Library Granted Patent US 9,171,837
Granted Patent B2
US 9,171,837 · App. 14/094,890 · Granted Oct 27, 2015

Cascode circuit

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Quick Facts
Patent No.
US 9,171,837
App. No.
14/094,890
Granted
Oct 27, 2015
Kind
B2
Abstract

A cascode circuit arrangement has a low voltage MOSFET and a depletion mode power device mounted on a substrate (for example a ceramic substrate), which can then be placed in a semiconductor package. This enables inductances to be reduced, and can enable a three terminal packages to be used if desired.

Claims (45)

1. A cascode transistor circuit comprising:

a first, depletion mode transistor having its drain for connection to a high power line;

a second, silicon MOSFET with its drain connected to the source of the first transistor and its source for connection to a low power line;

a substrate on which the first and second transistors are mounted, which has a conductive track providing the connection between the source of the first transistor and the drain of the second transistor; and

wherein the first, depletion mode, transistor comprises a high electron mobility transistor or a junction gate field effect transistor.

2. A cascode transistor circuit as claimed in claim 1 , formed as a packaged device, with a first connection from the first transistor drain to a first package terminal, a second connection from the second transistor gate to a second package terminal and a third connection from the second transistor source to a third package terminal, wherein one of the package terminals comprises a die attach pad terminal.

3. A circuit as claimed in claim 2 , wherein the second transistor source connects to the die attach pad terminal.

4. A circuit as claimed in claim 2 , comprising a three terminal package.

5. A circuit as claimed in claim 1 , wherein the second transistor is a vertical device.

6. A circuit as claimed in claim 5 , wherein the second transistor drain is at the bottom.

7. A circuit as claimed in claim 1 , wherein the substrate ( 43 ) comprises a ceramic substrate.

8. A circuit as claimed in claim 1 ,

wherein the first transistor comprises solder bumps and is flip bonded onto the substrate.

9. A circuit as claimed in claim 1 , wherein the second transistor comprises connection clips which connect onto the substrate.

10. A circuit as claimed in claim 1 , comprising further components mounted on the substrate.

11. A circuit as claimed in claim 10 , wherein the further components comprise:

a capacitor, RC snubber circuit or diode for limiting the maximum voltage at the drain of the first transistor point; or

a diode for power factor correction.

12. A circuit as claimed in claim 1 , wherein the first, depletion mode, transistor comprises a GaN transistor.

13. A circuit arrangement comprising:

a cascode transistor circuit as claimed in claim 1 ; and

a gate driver circuit having a single gate output line.

14. A device comprising a circuit arrangement as claimed in claim 13 , wherein the device comprises:

a power supply; or

a power factor correction circuit; or

an inverter circuit; or

a switched mode power converter circuit.

15. A cascode transistor circuit comprising:

a first, depletion mode transistor having its drain for connection to a high power line;

a second, silicon MOSFET with its drain connected to the source of the first transistor and its source for connection to a low power line;

a substrate on which the first and second transistors are mounted, which has a conductive track providing the connection between the source of the first transistor and the drain of the second transistor; and

further components mounted on the substrate, wherein the further components include:

a capacitor, RC snubber circuit or diode for limiting the maximum voltage at the drain of the first transistor point; or

a diode for power factor correction.

16. A circuit arrangement comprising:

a cascode transistor circuit including,

a first, depletion mode transistor having its drain for connection to a high power line;

a second, silicon MOSFET with its drain connected to the source of the first transistor and its source for connection to a low power line;

a substrate on which the first and second transistors are mounted, which has a conductive track providing the connection between the source of the first transistor and the drain of the second transistor; and

a gate driver circuit having a single gate output line.

17. A device comprising a circuit arrangement as claimed in claim 16 , wherein the device comprises:

a power supply; or

a power factor correction circuit; or

an inverter circuit; or

a switched mode power converter circuit.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 048328/0964 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2016
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 039610/0734 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2013
From: RUTTER, PHILIP; SONSKY, JAN; ROSE, MATTHIAS
To: NXP B.V.
Reel/Frame 031703/0519 →