Ion implantation apparatus

1. An ion implantation apparatus comprising:

a plurality of units for accelerating an ion beam generated in an ion source; and

a plurality of units for adjusting a scan beam and implanting ions into a wafer, wherein

a horizontal U-shaped loop-back type beamline having opposite long straight portions includes the plurality of units for adjusting the scan beam in a long straight portion to have a length substantially identical to those of the ion source and the plurality of units for accelerating the ion beam.

2. The ion implantation apparatus according to claim 1 , wherein

a work space allowing a work on the plurality of units is provided in a central region of the U-shaped loop-back type beamline having the opposite long straight portions, and the ion implantation has a layout with the central region as a maintenance area.

3. The ion implantation apparatus according to claim 2 , wherein

the plurality of units includes a high-energy multi-stage linear acceleration unit and a beam transport line unit, and

the high-energy multi-stage linear acceleration unit and the beam transport line unit are disposed to face each other across the work space of the U-shaped folder type beamline.

4. The ion implantation apparatus according to claim 3 , wherein

the plurality of units includes:

an ion beam generation unit provided in an upstream side of the beamline and configured to generate the ion beam;

a substrate supplying/processing unit provided in a downstream side of the beamline and configured to supply and process a substrate into which ions are to be implanted; and

a deflection unit provided in a middle of the beamline directed from the ion beam generation unit to the substrate supplying/processing unit and configured to deflect a trajectory of the ion beam,

the ion beam generation unit and the substrate supplying/processing unit are disposed in one side of the entire beamline, and

the deflection unit is disposed in the other side of the entire beamline.

5. The ion implantation apparatus according to claim 4 , wherein

the ion beam generation unit includes an ion source, an extraction electrode, and a mass analyzer,

the deflection unit includes an energy filter,

the beam transport line unit includes a beam shaper, abeam scanner, a beam collimator, and a final energy filter, and

the ion implantation apparatus accelerates the ion beam, which is generated by the ion beam generation unit, in the high-energy multi-stage linear acceleration unit, changes a trajectory of the ion beam by the deflection unit, and irradiates with the ion beam the substrate placed in the substrate supplying/processing unit provided at the end of the beam transport line unit.

6. The ion implantation apparatus according to claim 4 , wherein

the deflection unit includes an energy filter magnet, a trajectory adjustment lens, an energy defining slit, and an angle deflection magnet.

7. The ion implantation apparatus according to claim 6 , wherein

the energy filter magnet and the angle deflection magnet are configured such that a total deflection angle becomes 180 degrees.

8. The ion implantation apparatus according to claim 6 , wherein

the energy filter magnet and the angle deflection magnet are configured such that each deflection angle becomes 90 degrees.

9. The ion implantation apparatus according to claim 2 , wherein

the ion implantation apparatus has a scan beam collimation system made by using an electrostatic deflection type parallel lens device.

10. The ion implantation apparatus according to claim 2 , wherein

a communication passage allowing an operator to move between the work space and an outside is provided in an inlet portion of the U-shaped folder type beamline.

11. An ion implantation apparatus comprising:

a first section having a long beamline made by an ion beam generation unit and a high-energy multi-stage linear acceleration unit;

a second section for changing a trajectory of the ion beam by a deflection unit including an energy filter; and

a third section having a long beamline made by a beam transport line unit including a beam shaper device, a scanner device, an electrostatic parallel lens device, and a final energy filter, wherein

the first section, the second section, and the third section form a high-energy ion implantation beamline, and

the first section and the third section are disposed to face each other to form a U-shaped device layout having opposite long straight portions that realize high-energy high-accuracy implantation.