ILLUMINATION SOURCE WITH DIRECT DIE PLACEMENT
An illumination source includes a heat sink with an inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is pressed into a thermally-conductive compound disposed between the LED assembly and the inner core region. A retaining clamp is used to mechanically press the LED assembly into the thermally-conductive compound.
1 . An illumination source comprising:
a heat sink having an inner core region and an outer core region, wherein the inner core region comprises a planar portion and the outer core region includes a plurality of structures configured to dissipate heat emanating from the inner core region;
an LED assembly including an LED light source coupled to a planar substrate, wherein the planar substrate is disposed wholly above the inner core region, and wherein the LED assembly generates heat; and
a thermally-conductive compound disposed between the planar substrate and the planar portion of the inner core region, the thermally-conductive compound configured to conduct heat from the LED assembly to the inner core region.
2 . The illumination source of claim 1 , wherein a diameter of the inner core region is from about 25% to about 45% a diameter of the outer core region.
3 . The illumination source of claim 1 , wherein the planar portion is disposed at a height from about 30% to about 50% from a base of the heat sink to a top of the heat sink.
4 . The illumination source of claim 1 , further comprising a retaining clamp configured to mechanically press the LED assembly onto the thermally-conductive compound.
5 . The illumination source of claim 1 , further comprising a GU5.3 form factor base comprising LED assembly driving components, wherein an operating temperature of the LED assembly driving components is greater than approximately 90 degrees C.
6 . The illumination source of claim 5 , wherein the GU5.3 form factor base further comprises:
a thermally-conductive shell; and
a thermally-conductive potting compound; wherein,
the LED assembly driving components are disposed within the thermally-conductive shell; and
the thermally-conductive potting compound is disposed within the thermally-conductive shell and the LED assembly driving components.
7 . The illumination source of claim 5 , wherein the LED assembly driving components receive 12 volts AC input voltage and provide an output voltage.
8 . The illumination source of claim 7 , wherein the output voltage is selected from a group consisting of approximately 40 VAC, approximately 120 VAC, and approximately 180 VAC.
9 . The illumination source of claim 1 , wherein the heat sink comprises a material having a thermal emissivity greater than approximately 0.7.
10 . The illumination source of claim 1 , wherein the heat sink comprises an aluminum alloy.
11 . The illumination source of claim 1 , further comprising a lens assembly coupled to the heat sink, the lens assembly providing modified light in response to light received from the LED light source.
12 . The illumination source of claim 11 , wherein the modified light is selected from a spot light, a narrow-beam flood light, a wide-beam flood light, and an area light.
13 . A method for making an illumination source comprising:
receiving a heat sink comprising an inner core region and an outer core region, wherein the inner core region comprises a planar portion and the outer core region comprises a plurality of structures configured to dissipate heat from the inner core region;
disposing a thermally-conductive compound on the planar portion of the inner core region, the thermally-conductive compound configured to thermally conduct heat from the LED assembly to the inner core region; and
disposing an LED assembly comprising an LED light source that generates heat on the thermally-conductive compound.
14 . The method of claim 13 , wherein a diameter of the inner core region is from about 25% to about 45% a diameter of the outer core region.
15 . The method of claim 13 , wherein the planar portion is disposed at a height from about 30% to about 50% from a base of the heat sink to a top of the heat sink.
16 . The method of claim 13 , further comprising disposing a retaining clamp to mechanically press the LED assembly on the thermally-conductive compound.
17 . The method of claim 13 , further comprising:
providing a GU5.3 form factor base having a plurality of LED assembly driving components; and
coupling the GU5.3 form factor base to an interior channel of the heat sink.
18 . The method of claim 17 , wherein providing the GU5.3 form factor base comprises:
providing a metallic shell compatible with the GU5.3 form factor;
providing an LED assembly driving circuitry;
disposing the LED assembly driving circuitry within the metallic shell; and
disposing a potting compound within the metallic shell between the LED assembly driving circuitry and the metallic shell.
19 . The method of claim 18 , wherein providing the LED assembly driving circuitry comprises providing a voltage transformer circuit on a printed circuit.
20 . The method of claim 18 , further comprising electrically coupling the LED assembly to the LED assembly driving circuitry using a hot bar soldering process.
21 . The method of claim 18 , wherein coupling the GU5.3 form factor base comprises securing a lip of the GU5.3 form factor base to a portion of the inner core region of the heat sink.
22 . The method of claim 13 , further comprising:
disposing a lens assembly on top of the LED assembly; and
securing the lens assembly to the heat sink.
23 . The method of claim 13 , wherein receiving the LED assembly comprises:
receiving one or more LED light sources; and
coupling a printed circuit to the one or more LED light sources.
24 . An illumination source formed according to the method of claim 13 .