IP Library Granted Patent US 9,263,357
Granted Patent B2
US 9,263,357 · App. 14/098,580 · Granted Feb 16, 2016

Carrier with hollow chamber and support structure therein

Inventor: Steffen Bieselt (Wehlen, DE)
Assignee: INFINEON TECHNOLOGIES DRESDEN GMBH
H01L23/053H01L21/02104H01L21/481H01L21/76224H05K1/02H01L2924/0002
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Quick Facts
Patent No.
US 9,263,357
App. No.
14/098,580
Granted
Feb 16, 2016
Kind
B2
Abstract

According to various embodiments, a carrier may include: a hollow chamber spaced apart from a surface of the carrier; and at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure includes an electrically insulating material.

Claims (34)

1. A carrier comprising:

a hollow chamber spaced apart from a surface of the carrier; and

at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure comprises an electrically insulating material,

wherein the at least one support structure comprises a core region and a liner structure at least laterally surrounding the core region, the core region comprising the electrically insulating material.

2. The carrier according to claim 1 ,

wherein the electrically insulating material comprises at least one material from the following group of materials, the group consisting of: an oxide, a nitride, an oxynitride.

3. The carrier according to claim 1 ,

wherein the at least one support structure has at least one of a cylindrical shape and a prismatic shape and extends within the hollow chamber from the first region to the second region of the carrier.

4. The carrier according to claim 1 , further comprising:

a trench structure extending from the surface of the carrier to the hollow chamber, wherein the trench structure laterally surrounds at least a part of the first region of the carrier.

5. The carrier according to claim 1 , further comprising:

an electronic circuit disposed at least one of over and in the first region of the carrier.

6. A carrier comprising:

a hollow chamber spaced apart from a surface of the carrier; and

at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure comprises an electrically insulating material,

wherein the at least one support structure comprises a core region and a liner structure at least laterally surrounding the core region, the liner structure comprising a nitride and the core region comprising an oxide.

7. The carrier according to claim 6 ,

wherein the at least one support structure has at least one of a cylindrical shape and a prismatic shape and extends within the hollow chamber from the first region to the second region of the carrier.

8. The carrier according to claim 6 , further comprising:

a trench structure extending from the surface of the carrier to the hollow chamber, wherein the trench structure laterally surrounds at least a part of the first region of the carrier.

9. The carrier according to claim 6 , further comprising:

an electronic circuit disposed at least one of over and in the first region of the carrier.

10. A carrier comprising:

a hollow chamber spaced apart from a surface of the carrier; and

at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure comprises an electrically insulating material,

wherein the at least one support structure comprises a core region and a liner structure completely surrounding the core region, the liner structure comprising the electrically insulating material.

11. The carrier according to claim 10 ,

wherein the electrically insulating material comprises at least one material from the following group of materials, the group consisting of: an oxide, a nitride, an oxynitride.

12. The carrier according to claim 10 ,

wherein the at least one support structure has at least one of a cylindrical shape and a prismatic shape and extends within the hollow chamber from the first region to the second region of the carrier.

13. The carrier according to claim 10 , further comprising:

a trench structure extending from the surface of the carrier to the hollow chamber, wherein the trench structure laterally surrounds at least a part of the first region of the carrier.

14. The carrier according to claim 10 , further comprising:

an electronic circuit disposed at least one of over and in the first region of the carrier.

Assignments (2)
CHANGE OF NAME Recorded Jun 12, 2024
From: INFINEON TECHNOLOGIES DRESDEN GMBH
To: INFINEON TECHNOLOGIES DRESDEN GMBH & CO. KG
Reel/Frame 067699/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2013
From: BIESELT, STEFFEN
To: INFINEON TECHNOLOGIES DRESDEN GMBH
Reel/Frame 031768/0476 →
Continuity (1)
Related Publication 20150162254A1 · Jun 11, 2015