Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
View Patent ↗According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package.
1. A power quad flat no-lead (PQFN) package comprising:
a U-phase output node situated on a first leadframe island of a leadframe;
a V-phase output node situated on a second leadframe island of said leadframe;
a W-phase output node situated on a W-phase die pad of said leadframe;
wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad.
2. The PQFN package of claim 1 , comprising a first W-phase power switch situated on said W-phase die pad.
3. The PQFN package of claim 1 , comprising at least one wirebond connected to said W-phase die pad.
4. The PQFN package of claim 2 , comprising at least one wirebond connecting a source of a second W-phase power switch to said W-phase die pad.
5. The PQFN package of claim 1 , comprising at least one wirebond connected to said first leadframe island of said leadframe.
6. The PQFN package of claim 1 , comprising at least one wirebond connected to said second leadframe island of said leadframe.
7. The PQFN package of claim 1 , wherein said first leadframe island is exposed on a bottom-side of said PQFN package.
8. The PQFN package of claim 1 , wherein said second leadframe island is exposed on a bottom-side of said PQFN package.
9. The PQFN package of claim 1 , wherein said W-phase die pad is a W-phase output terminal of said PQFN package.
10. The PQFN package of claim 1 , wherein said second leadframe island is on a corresponding second leadframe strip of said leadframe, said corresponding second leadframe strip connected to a V-phase die pad.
11. The PQFN package of claim 1 , comprising a first U-phase power switch situated on a U-phase die pad of said leadframe and a first V-phase power switch situated on a V-phase die pad of said leadframe.
12. The PQFN package of claim 11 , comprising a second U-phase power switch, a second V-phase power switch, and a second W-phase power switch situated on a common die pad of said leadframe.
13. The PQFN package of claim 12 , wherein said U-phase, V-phase, and W-phase power switches comprise group 111 -V transistors.
14. The PQFN package of claim 1 , wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.
15. The PQFN package of claim 1 , wherein said PQFN package has a footprint of less than 12 mm by 12 mm.
16. A power quad flat no-lead (PQFN) package comprising:
a U-phase output node situated on a first leadframe island;
wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad;
a V-phase output node situated on a second leadframe strip of said leadframe, said second leadframe strip connected to a V-phase die pad of said leadframe;
a W-phase output node situated on a W-phase die pad of said leadframe.
17. The PQFN package of claim 16 , comprising a first W-phase power switch situated on said W-phase die pad.
18. The PQFN package of claim 16 , wherein said W-phase die pad is a W-phase output terminal of said PQFN package.
19. The PQFN package of claim 16 , comprising at least one wirebond connected to said W-phase die pad.