IP Library Granted Patent US 9,324,646
Granted Patent B2
US 9,324,646 · App. 14/102,379 · Granted Apr 26, 2016

Open source power quad flat no-lead (PQFN) package

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,324,646
App. No.
14/102,379
Granted
Apr 26, 2016
Kind
B2
Abstract

According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase, V-phase, and W-phase power switches situated on the PQFN leadframe. A drain of the U-phase power switch is connected to a U-phase output strip of the PQFN leadframe. A source of the U-phase power switch is connected to a U-phase current sense terminal. The U-phase output strip can substantially traverse across the PQFN leadframe. Another U-phase power switch is situated on the PQFN leadframe with a source of the another U-phase power switch connected to the U-phase output strip of the PQFN leadframe. The PQFN leadframe can include a leadframe island within the U-phase output strip. At least one wirebond may be connected to the U-phase output strip.

Claims (35)

1. A power quad flat no-lead (PQFN) package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe;

said U-phase power switch being the only power switch situated on a U-phase output strip of said leadframe;

a drain of said U-phase power switch being connected to said U-phase output strip of said leadframe;

wherein said U-phase output strip substantially traverses across said leadframe;

a source of said U-phase power switch being connected to a U-phase current sense terminal.

2. The (PQFN) package of claim 1 , wherein a V-phase output strip substantially traverses across said leadframe.

3. The (PQFN) package of claim 1 comprising a first leadframe island within said U-phase output strip.

4. The (PQFN) package of claim 1 comprising at least one wirebond connected to said U-phase output strip.

5. The (PQFN) package of claim 1 comprising another U-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip of said leadframe.

6. The (PQFN) package of claim 1 , comprising at least one wirebond connecting said source of said U-phase power switch to said U-phase current sense terminal.

7. The (PQFN) package of claim 1 , wherein said U-phase power switch is situated on a U-phase output pad of said leadframe.

8. The (PQFN) package of claim 1 comprising a driver integrated circuit (IC) situated on said leadframe and connected to gates of said U-phase, V-phase, and W-phase power switches.

9. The (PQFN) package of claim 1 , wherein said U-phase, V-phase, and W-phase power switches comprise group 111 -V transistors.

10. The (PQFN) package of claim 1 , wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.

11. The (PQFN) package of claim 1 , wherein said PQFN package has a footprint of less than 12 mm by 12 mm.

12. A power quad flat no-lead (PQFN) package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;

said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;

said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;

wherein said U-phase output strip substantially traverses across said leadframe;

sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals.

13. The (PQFN) package of claim 12 , wherein said V-phase output strip substantially traverses across said leadframe.

14. The (PQFN) package of claim 12 comprising a first leadframe island within said U-phase output strip and a second leadframe island within said V-phase output strip.

15. The (PQFN) package of claim 12 , comprising at least one wirebond connecting said source of said V-phase power switch to said V-phase current sense terminal.

16. The (PQFN) package of claim 12 comprising another U-phase power switch and another V-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip and a source of said another V-phase power switch connected to said V-phase output strip.

17. The (PQFN) package of claim 12 , wherein said U-phase power switch is situated on a U-phase output pad of said leadframe and said V-phase power switch is situated on a V-phase output pad of said leadframe.

18. A power quad flat no-lead (PQFN) package, including a single driver integrated circuit (IC), said PQFN package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;

said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;

said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;

wherein said U-phase output strip substantially traverses across said leadframe;

sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals;

said single driver IC situated on a driver IC pad of said leadframe, said single driver IC being connected to said U-phase output strip and to said V-phase output strip.

19. The (PQFN) package of claim 18 , wherein said V-phase output strip substantially traverses across said leadframe.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2014
From: FERNANDO, DEAN; BARBOSA, ROEL; TAKAHASHI, TOSHIO
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 031999/0329 →