Semiconductor device and method for fabricating the same
View Patent ↗A semiconductor device includes: a channel layer made of GaN; a barrier layer formed on the channel layer, the bather layer being made of AlGaN and having a larger band gap than the channel layer; a p-type GaN layer selectively formed on the barrier layer; a gate electrode made of ITO on the p-type GaN layer; and a source electrode and a drain electrode on regions of the barrier layer laterally outward of the gate electrode. The width of the gate electrode in the gate length direction is smaller than or equal to the width of the p-type GaN layer in the gate length direction, and the difference between the width of the gate electrode in the gate length direction and the width of the p-type GaN layer in the gate length direction is less than or equal to 0.2 μm.
1. A semiconductor device comprising:
a first nitride semiconductor layer including a channel region;
a second nitride semiconductor layer formed on the first nitride semiconductor layer, the second nitride semiconductor layer having a larger band gap than the first nitride semiconductor layer;
a third nitride semiconductor layer selectively formed on the second nitride semiconductor layer, the third nitride semiconductor layer having a p-type conductivity;
a fourth nitride semiconductor layer formed on the third nitride semiconductor layer, the fourth nitride semiconductor layer having p-type conductivity and a higher carrier concentration than the third nitride semiconductor layer;
a gate electrode formed on the fourth nitride semiconductor layer, the gate electrode being made of a refractory material; and
a source electrode and a drain electrode formed on regions of the second nitride semiconductor layer laterally outward of the gate electrode, wherein
a width of the gate electrode in a gate length direction is smaller than a width of the third nitride semiconductor layer in the gate length direction, and
a difference between the width of the gate electrode in the gate length direction and the width of the third nitride semiconductor layer in the gate length direction is less than or equal to 0.2 μm,
wherein the gate electrode has a lower portion being in contact with the fourth nitride semiconductor layer, and including a first metal layer, the first metal layer being made of an alloy containing palladium,
the first metal layer has a thickness of 20 nm or less, and
the gate electrode has an upper portion includes a second metal layer made of gold or an alloy containing gold.
2. The semiconductor device of claim 1 , wherein
the second nitride semiconductor layer includes a recessed portion formed in a formation region of the third nitride semiconductor layer, and
at least a lower portion of the third nitride semiconductor layer is in the recessed portion of the second nitride semiconductor layer.
3. The semiconductor device of claim 1 , wherein the fourth nitride semiconductor layer is in ohmic contact with the gate electrode.