Light emitting device and manufacturing method for the same
The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.
1. A light emitting device comprising:
a light emitting diode (LED) chip;
a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip; and
a sub heat radiation path formed to radiate heat of the wavelength conversion plate, the sub heat radiation path comprising:
a transparent heat-conductive film provided on a surface of the wavelength conversion plate;
a heat radiator provided in the vicinity of the LED chip; and
a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.
2. The light emitting device according to claim 1 , wherein
the heat radiator is a mount, and the LED chip is mounted on the mount through flip-chip mounting.
3. The light emitting device according to claim 1 , wherein
the transparent heat-conductive film is provided on a light output surface of the wavelength conversion plate, and a wire is used as the thermal connection member.
4. The light emitting device according to claim 1 , wherein
the wavelength conversion plate is formed to be large enough to extend off a peripheral edge of the LED chip, the transparent heat-conductive film is provided on at least an extending portion of a light input surface of the wavelength conversion plate that extends off the peripheral edge of the LED chip, and a heat-conductive block that mechanically supports the extending portion of the wavelength conversion plate is used as the thermal connection member.
5. The light emitting device according to claim 1 , wherein
the wavelength conversion plate is formed to be large enough to extend off a peripheral edge of the LED chip, the transparent heat-conductive film is provided on at least an extending portion of a light input surface of the wavelength conversion plate that extends off the peripheral edge of the LED chip, and a support block that mechanically supports the extending portion of the wavelength conversion plate is provided, and a wire that is connected to the transparent heat-conductive film for the extending portion of the wavelength conversion plate is used as the thermal connection member.
6. The light emitting device according to claim 1 , wherein
the wavelength conversion plate is formed to be large enough to extend off a peripheral edge of the LED chip, the transparent heat-conductive film is provided on at least an extending portion of a light output surface of the wavelength conversion plate that extends off the peripheral edge of the LED chip, and a heat-conductive frame that surrounds a side perimeter of the wavelength conversion plate is used as the thermal connection member.
7. The light emitting device according to claim 1 , further comprising:
a light-reflective covering material that covers a perimeter of the LED chip wherein,
the thermal connection member is embedded in the light-reflective covering material.
8. The light emitting device according to claim 7 , wherein
the wavelength conversion plate has tapered side end surfaces that become narrower as the side end surfaces extend upward, and the light-reflective covering material also covers the side end surfaces of the wavelength conversion plate.
9. A manufacturing method for a light emitting device, comprising:
mounting a light emitting diode (LED) chip on a mount through flip-chip mounting;
disposing a wavelength conversion plate on a light output surface side of the LED chip, the wavelength conversion plate including a fluorescent substance, a transparent heat-conductive film being provided on a surface of the wavelength conversion plate; and
thermally connecting the transparent heat-conductive film to the mount by a thermal connection member.