Method of fabricating a wafer level optical lens assembly

1. A method of fabricating a wafer level optical lens assembly, comprising:

providing a first wafer substrate having a plurality of bumps;

applying a first polymer liquid on a first contact optical surface of said plurality of bumps;

providing a second wafer substrate;

contacting said first wafer substrate with said second substrate in such that said first polymer liquid is located in a slit created between said first contact optical surface of said plurality of bumps and said second wafer substrate under capillary forces;

curing said polymer liquid(s) to form a lens;

filling a third polymer between said first wafer substrate and said second wafer substrate utilizing a capillary phenomenon, and curing said third polymer to form an integral structure located between said first wafer substrate and said second wafer substrate, wherein said integral structure is separated by a plurality of lenses.

2. A method according to claim 1 , further comprising applying a second polymer liquid on said second wafer substrate before contacting said first wafer substrate with said second substrate.

3. A method according to claim 2 , further comprising curing said second polymer liquid before contacting said first wafer substrate with said second substrate.

4. A method according to claim 3 , further comprising applying an additional structure layer onto the surface of the cured first polymer and/or the second cured polymer, wherein said additional structure is chosen from the group of aperture, diaphragm and filter, before contacting said first wafer substrate with said second wafer substrate.

5. A method according to claim 4 , wherein the step of applying said additional structure layer is carried out by a coating step, a step of screen printing, ink jet printing or a step of 3 D printing.

6. A method according to claim 2 , wherein the second polymer liquid is chosen such that the contact angle between the second polymer liquid and the first contact surface is less than 90 degrees.

7. A method according to claim 1 , wherein said second wafer substrate is a wafer substrate having a plurality of bumps, further comprising applying a second polymer liquid on a second contact surface of said plurality of bumps.

8. A method according to claim 7 , wherein said step of contacting said first wafer substrate with said second substrate is carried such that the plurality of bumps present on said first wafer substrate are in alignment with the plurality of bumps present on said second wafer substrate.

9. A method according to claim 7 , wherein the shape of the first and second contact surface of the bumps is chosen from the group of flat, convex, concave, freeform optic, microfluidic, refractive, diffractive, micro lens array and Fresnel.

10. A method according to claim 9 , wherein the shape of the first contact surface differs from the shape of the second contact surface.

11. A method according to claim 7 , wherein the side walls of the bumps have a parabolic shape, especially that the side walls of the bumps are provided with a reflective, antireflective layer and/or antireflective structure.

12. A method according to claim 1 , further comprising curing said first polymer liquid before contacting said first wafer substrate with said second substrate.

13. A method according to claim 1 , wherein at least one of said first wafer substrate and said second wafer substrate is provided with spacers for contacting and positioning to a preset distance between said first wafer substrate and said second wafer substrate after said step of contacting said first wafer substrate with said second substrate, especially for positioning in the XY+Z direction.

14. A method according to claim 1 , further comprising removing the first wafer substrate and the second wafer substrate.

15. A method according to claim 14 , further comprising singulating the assembly of lenses and integral structure into single or plural lens carrier systems.

16. A method according to claim 1 wherein the thickness of the integral structure formed by said third polymer is greater than the thickness of the lens(es).

17. A method according to claim 1 , wherein the first polymer liquid is chosen such that the contact angle between said the first polymer liquid and said first contact surface is less than 90 degrees.

18. A method according to claim 1 further comprising applying a fourth polymer liquid onto the surface of the cured first polymer and/or the second cured polymer, eventually provided with an additional structure layer, before contacting said first wafer substrate with said second wafer substrate.

19. A method according to claim 1 , wherein said curing is carried out by irradiating with UV and/or by thermal exposure.

20. A wafer level optical integral lens support, comprising:

a support formed utilizing a capillary phenomenon, having at least one through hole and

at least one lens, each located within each through hole and embedded therein, and a thickness of each lens being less than a thickness of the support, wherein both outer ends of each lens located within said through hole are radii shaped under the action of capillary forces.

21. A wafer level optical integral lens support according to claim 20 , wherein said at least one lens comprises a first cured polymer and a second cured polymer, wherein the range of index (n) and Abbe properties of said first cured polymer and a second cured polymer are different.

22. A wafer level optical integral lens support according to claim 20 , wherein said support is made of a light-shielding material or a light-absorbing material.

23. A wafer level optical integral lens support according to claim 20 , wherein said at least one lens comprises an additional structure chosen from the group of aperture, diaphragm and filter.

24. A wafer level optical integral lens support according to claim 20 , wherein the shape of said at least one lens is chosen from the group of flat, convex, concave, freeform optic, microfluidic, refractive, diffractive, micro lens array and Fresnel.