IP Library Granted Patent US 9,541,578
Granted Patent B2
US 9,541,578 · App. 14/112,176 · Granted Jan 10, 2017

Capacitive sensor sheet producing method and capacitive sensor sheet

Inventors: Satoshi Shimada (Saitama, JP); Hiroto Komatsu (Saitama, JP)
Assignee: Shin-Etsu Polymer Co., Ltd.
G01R3/00G01R27/2605G06F3/044G06F2203/04103Y10T29/49162
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Quick Facts
Patent No.
US 9,541,578
App. No.
14/112,176
Granted
Jan 10, 2017
Kind
B2
Abstract

A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.

Claims (22)

1. A capacitive sensor sheet producing method for producing a capacitive sensor sheet by using a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed, the conductive nanowires partially projecting from a surface of the binder resin layer, comprising the steps of:

when a plurality of detection electrodes of a conductive pattern layer are formed by shaping a binder resin layer of a base, removing a binder resin from projections of conductive nanowires partially projected from surface ends of at least partial detection electrodes of the plurality of detection electrodes by implementing a surface etching and shaping treatment on the surface ends, the conductive nanowires partially projected from the surface ends having an adhering area of the binder resin and an exposing area of the conductive nanowire before the surface etching and shaping treatment;

forming wiring lines of the conductive pattern layer by applying a conductive material on an insulative base layer of the base and drying and curing the applied conductive material; and,

connecting the wiring lines to the projections of the conductive nanowires of the surface ends, the projections having more exposing area than that before the surface etching and shaping treatment.

2. The capacitive sensor sheet producing method according to claim 1 , wherein the surface etching and shaping treatment is carried out by either a dry etching method or a wet etching method.

3. The capacitive sensor sheet producing method according to claim 1 , wherein the surface etching and shaping treatment is carried out by either plasma treatment technique, ultraviolet ray treatment technique, or corona treatment technique.

4. The capacitive sensor sheet producing method according to claim 1 , wherein a surface of all the detection electrodes in the pattern layer is subjected to the surface etching and shaping treatment.

5. The capacitive sensor sheet producing method according to claim 1 , wherein a surface of the detection electrodes to be connected to the wiring lines is subjected to the surface etching and shaping treatment.

6. A capacitive sensor sheet having a conductive pattern layer formed on an insulative base layer and detecting a change in capacitance when a conductor approaches a detection electrode in the conductive pattern layer,

wherein

the conductive pattern layer includes:

a plurality of detection electrodes arrayed on the insulative base layer; and

wiring lines formed on the insulative base layer and connected to the plurality of detection electrodes, and

the plurality of detection electrodes is formed by forming a binder resin layer including conductive nanowires on the insulative base layer and shaping the binder resin layer so that the conductive nanowires are partially projected from a surface of the binder resin layer,

conductive nanowires partially projected from at least surface ends of the detection electrodes in the conductive pattern layer to which the wiring lines are connected, have an adhering area of the binder resin and an exposing area of the conductive nanowires,

a binder resin is removed from projections of the conductive nanowires partially projected from the surface ends by implementing a surface etching and shaping treatment on the surface ends, and

the projections of the conductive nanowires having more exposing area than that before the surface etching and shaping treatment are connected to the wiring lines.

7. The capacitive sensor sheet according to claim 6 , wherein the surface etching and shaping treatment is carried out by either a dry etching method or a wet etching method.

8. The capacitive sensor sheet according to claim 6 , wherein the surface etching and shaping treatment is carried out by either plasma treatment technique, ultraviolet ray treatment technique, or corona treatment technique.

9. The capacitive sensor sheet according to claim 6 , wherein a surface of all the detection electrodes of the pattern layer is subjected to the surface etching and shaping treatment.

10. The capacitive sensor sheet according to claim 6 , wherein the surface of the detection electrodes to be connected to the wiring lines is subjected to the surface etching and shaping treatment.

11. The capacitive sensor sheet according to claim 6 , wherein the base layer is formed of a pair of base layers opposing, and adhering to, each other, one base layer being formed with an X-pattern layer to array a plurality of X-detection electrodes in the X-direction, the other base layer being formed with a Y-pattern layer to array a plurality of Y-detection electrodes in the Y-direction, and at least surface ends of terminal X-detection electrodes which the wiring lines are laid over and connected to, among the plurality of X-detection electrodes in the X-pattern layer, are subjected to the surface etching and shaping treatment while at least surface ends of terminal Y-detection electrodes which the wiring lines are laid over and connected to, among the plurality of Y-detection electrodes in the Y-pattern layer, are subjected to the surface etching and shaping treatment.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT FIRST INVENTOR NAME PREVIOUSLY RECORDED ON REEL 031441 FRAME 0533. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT FIRST INVENTOR NAME FROM SATOSHI SHIMATA TO "SATOSHI SHIMADA". Recorded Feb 4, 2014
From: SHIMADA, SATOSHI; KOMATSU, HIROTO
To: SHIN-ETSU POLYMER CO., LTD.
Reel/Frame 032159/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2013
From: SHIMATA, SATOSHI; KOMATSU, HIROTO
To: SHIN-ETSU POLYMER CO., LTD.
Reel/Frame 031441/0533 →
Priority Claims (2)
JP 2011-096985 · Apr 25, 2011 · national
JP 2012-093534 · Apr 17, 2012 · national
Continuity (1)
Related Publication 20140035599A1 · Feb 6, 2014