IP Library › Granted Patent US 10,118,940
Granted Patent B2
US 10,118,940 · App. 14/115,495 · Granted Nov 6, 2018

Alkoxide compound and raw material for forming thin film

Inventors: Senji Wada (Tokyo, JP); Akio Saito (Tokyo, JP); Tomoharu Yoshino (Tokyo, JP)
Assignee: ADEKA CORPORATION
C07F15/045C07C215/08C23C16/06C23C16/406C23C16/45553
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Quick Facts
Patent No.
US 10,118,940
App. No.
14/115,495
Granted
Nov 6, 2018
Kind
B2
Abstract

An alkoxide compound represented by the following formula (I), and a raw material for thin film formation containing the alkoxide compound. In the formula, R 1 represents a linear or branched alkyl group having 2 to 4 carbon atoms, and R 2 and R 3 each represent a linear or branched alkyl group having 1 to 4 carbon atoms. In the formula (I), R 1 is preferably an ethyl group. It is also preferred that one or both of R 2 and R 3 be an ethyl group. The raw material for thin film formation including an alkoxide compound represented by general formula (I) is preferably used as a raw material for chemical vapor deposition.

Claims (15)

1. A raw material for film formation comprising an alkoxide compound represented by

one of the following compounds:

2. The raw material for thin film formation according to claim 1 to be used as a raw material for chemical vapor deposition.

3. The raw material for thin film formation according to claim 2 , the raw material comprising a precursor comprising the alkoxide compound and optionally a precursor excluding the alkoxide compound, wherein the precursor excluding the alkoxide compound is in a proportion of from 0 to 10 mol per mol of the alkoxide compound, and the raw material is delivered and fed by a vapor delivery method or a liquid delivery method in thin film production.

4. The raw material for thin film formation according to claim 2 , the raw material comprising an organic solvent and a precursor comprising the alkoxide compound and optionally a precursor excluding the alkoxide compound, wherein the content of the precursor comprising the alkoxide compound is 0.01 to 2.0 mol/liter, the precursor excluding the alkoxide compound is in a proportion of from 0 to 10 mol per mol of the alkoxide compound, and the raw material is delivered and fed by a liquid delivery method in thin film production.

5. The raw material for thin film formation according to claim 2 , the raw material comprising a precursor comprising the alkoxide compound and a precursor excluding the alkoxide compound, wherein the precursor excluding the alkoxide compound is in a proportion of from 0 to 10 mol per mol of the alkoxide compound, and the raw material is delivered and fed by a vapor delivery method or a liquid delivery method in thin film production.

6. The raw material for thin film formation according to claim 2 , the raw material comprising a precursor comprising the alkoxide compound, and the raw material is delivered and fed by a vapor delivery method or a liquid delivery method in thin film production.

7. The raw material for thin film formation according to claim 1 , the raw material comprising an organic solvent and a precursor comprising the alkoxide compound and a precursor excluding the alkoxide compound, wherein the content of the precursor comprising the alkoxide compound is 0.01 to 2.0 mol/liter, the precursor excluding the alkoxide compound is in a proportion of from 0 to 10 mol per mol of the alkoxide compound, and the raw material is delivered and fed by a liquid delivery method in thin film production.

8. The raw material for film formation according to claim 1 , wherein the alkoxide compound is in a liquid state under room temperature and room pressure.

9. The raw material for film formation according to claim 1 , further comprising at least one solvent selected from the group consisting of ethyl acetate, butyl acetate, methoxyethyl acetate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethyleneglycol, tetrahydrofuran, tetrahydropyran, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, dibutyl ether, dioxane, methyl butyl ketone, methyl isobutyl ketone, ethyl butyl ketone, dipropyl ketone, diisobutyl ketone, methyl amyl ketone, cyclohexanone, methylcyclohexanone, hexane, cyclohexane, methylcyclohexane, dimethylcyclohexane, ethylcyclohexane, heptane, octane, toluene, and xylene 1-cyanopropane, 1-cyanobutane, 1-cyanohexane, cyanocyclohexane, cycanobenzene, 1,3-dicyanopropane, 1,4-dicyanobutane, 1,6-dicyanohexane, 1,4-dicyanocyclohexane, 1,4-dicyanobenzene, pyridine and lutidine.

10. The raw material for film formation according to claim 9 , wherein a total amount of the alkoxide compound and other precursor(s) in the organic solvent is 0.01 to 2.0 mol/liter.

11. The raw material for film formation according to claim 9 , wherein a total amount of the alkoxide compound and other precursor(s) in the organic solvent is 0.05 to 1.0 mol/liter.

12. The raw material for film formation according to claim 1 , wherein the alkoxide compound is the Compound No. 4 having a 50% mass loss temperature of 195° C. and a boiling point of 102° C. at 120 Pa:

13. A raw material for film formation comprising an alkoxide compound represented by the following:

having a 50% mass loss temperature of 195° C. and a boiling point of 102° C. at 120 Pa.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2013
From: WADA, SENJI; SAITO, AKIO; YOSHINO, TOMOHARU
To: ADEKA CORPORATION
Reel/Frame 031538/0177 →
Priority Claims (1)
JP 2011-169103 · Aug 2, 2011 · national
Continuity (1)
Related Publication 20140174323A1 · Jun 26, 2014
Cited By (1)
US 12,276,022