High-voltage resistance and retention of printed flex circuits
A device includes an electrical connector coupled to the end of a flex circuit. The connector includes interior ribs that engage slots in the flex circuit, with the ribs and slots separating adjacent contact pads on the flex circuit. The contact pads are exposed portions of conductive traces on the flex circuit. Other portions of the conductive traces may be covered by a dielectric material, such as a non-conductive ink. The ribs provide an increased isolation path between the contact pads.
1. A device comprising:
an electrical connector; and
a flex circuit that is coupled to the electrical connector;
wherein the flex circuit includes a substrate, with conductive traces that terminate in contact pads;
wherein the flex circuit has slots between the contact pads;
wherein the slots extend into a non-conductive layer region where a non-conductive layer covers the conductive traces that terminate in the contact pads; and
wherein the non-conductive layer covers substantially all of a width of the flex circuit.
2. The device of claim 1 , wherein the substrate extends beyond the contact pads to the end of the flex circuit.
3. The device of claim 2 , wherein the slots extend into a portion of the substrate beyond the contact pads.
4. The device of claim 3 , wherein the slots are back from an edge of the flex circuit that is beyond the contact pads, by a predetermined amount.
5. The device of claim 1 , wherein the slots overlap the contact pads.
6. The device of claim 1 , wherein the slots are rectangular.
7. The device of claim 1 , wherein the contact pads do not extend all the way to an edge of the flex circuit that is beyond the contact pads, with the contact pads beyond offset from the edge by a predetermined amount.
8. The device of claim 1 , wherein the conductive traces are made of conductive ink.
9. The device of claim 1 , wherein the connector has ribs that fit into the slots.
10. The device of claim 9 , wherein the ribs are an integral part with one connector half of the connector.
11. The device of claim 10 , wherein the ribs extend from the one connector half to another connector half of the connector.
12. The device of claim 9 , wherein engagement of the ribs and the slots provides mechanical retention of the flex circuit in the connector.
13. The device of claim 9 , wherein the ribs in the connector body fit the slots in the flex circuit and extend beyond the contact pads both fore and aft of the contact pads.
14. The device of claim 9 , wherein the ribs and slots are positioned such that a potential current path is lengthened, avoiding current leakage and voltage breakdown.
15. The device of claim 9 , wherein respective of the ribs are located between respective of adjacent pairs of the contact pads.
16. The device of claim 9 , wherein the connector includes conductive contacts that press against respective of the contact pads.
17. The device of claim 16 , wherein the contacts are in a header body clamped between connector halves of the connector.
18. A flex circuit comprising:
a substrate; and
conductive traces that terminate in contact pads;
wherein the flex circuit has slots between the contact pads;
wherein the slots extend into a non-conductive region where a non-conductive layer covers the conductive traces that terminate in the contact pads; and
wherein the non-conductive layer covers substantially all of a width of the flex circuit.
19. The device of claim 18 , wherein the substrate extends beyond the contact pads to the end of the flex circuit.
20. The device of claim 19 , wherein the slots extend into a portion of the substrate beyond the contact pads.
21. The device of claim 20 , wherein the slots are back from an edge of the flex circuit that is beyond the contact pads, by a predetermined amount.
22. The device of claim 18 , wherein the slots overlap the contact pads.
23. The device of claim 18 , wherein the slots are rectangular.
24. The device of claim 18 , wherein the contact pads do not extend all the way to an edge of the flex circuit that is beyond the contact pads, with the contact pads beyond offset from the edge by a predetermined amount.
25. The device of claim 18 , wherein the conductive traces are made of conductive ink.
26. The device of claim 18 , wherein the substrate is a plastic substrate.