IP Library Granted Patent US 9,413,351
Granted Patent B2
US 9,413,351 · App. 14/122,556 · Granted Aug 9, 2016

Integrated circuit device and method of implementing power gating within an integrated circuit device

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Quick Facts
Patent No.
US 9,413,351
App. No.
14/122,556
Granted
Aug 9, 2016
Kind
B2
Abstract

An integrated circuit device comprises at least one power gating arrangement, including at least one gated power domain, and at least one power gating component operably coupled between at least one node of the at least one gated power domain and at least a first power supply node. The at least one power gating component is arranged to selectively couple the at least one node of the at least one gated power domain to the at least first power supply node.

Claims (31)

1. An integrated circuit device comprising:

a power domain;

a power gating component operatively coupled between a node of the power domain and a power supply node to electrically couple the node of power domain to the power supply node when enabled;

an isolation component operatively coupled between a chargeable device and the node of the power domain to electrically couple the chargeable device to node of the power domain when enabled; and

a power gating control module coupled to the isolation component and to the power gating component to electrically de-couple the chargeable device from the node of the power domain, to electrically couple the power supply node while the chargeable device is electrically de-coupled from the node of the power domain, and, after waiting for a non-zero period of time and while the node of the power domain is electrically coupled to the power supply node, electrically couple the chargeable device to the node of the power domain.

2. The integrated circuit device of claim 1 wherein the isolation component is coupled in series between the chargeable device and the node of the power domain.

3. The integrated circuit device of claim 1 wherein the power gating component is arranged to receive a power gating control signal at an input thereof, and to electrically couple the node of the power domain to the power supply node in accordance with the received power gating control signal.

4. The integrated circuit device of claim 1 wherein the power gating component comprises a metal oxide semiconductor field effect transistor.

5. The integrated circuit device of claim 1 wherein the isolation component is arranged to receive an isolation control signal at an input thereof, and to electrically couple the chargeable device to the node of the power domain in accordance with the received isolation control signal.

6. The integrated circuit device of claim 5 wherein the isolation component comprises a metal oxide semiconductor field effect transistor.

7. The integrated circuit device of claim 1 wherein the power gating control module is further arranged to configure the isolation component to electrically de-couple the chargeable device from the node of the power domain prior to electrically coupling the node of the power domain to the power supply node.

8. The integrated circuit device of claim 1 wherein the power gating control module is further arranged to configure the isolation component to electrically de-couple the chargeable device from the node of the power domain prior to the node of the power domain being electrically decoupled from the power supply node.

9. The integrated circuit device of claim 7 wherein the power gating control module is further arranged to configure the isolation component to progressively electrically couple the chargeable device to the node of power domain, following electrically coupling the node of the power domain to the power supply node.

10. The integrated circuit device of claim 1 wherein the chargeable device comprises a capacitance such as a de-coupling capacitance.

11. A method of implementing power gating within an integrated circuit device, the method comprising:

electrically decoupling a chargeable device from a node of a power domain prior to electrically coupling the power domain to a power supply node;

subsequent to electrically decoupling the chargeable device, electrically coupling the power domain to the power supply node;

in response to electrically coupling the power domain to the power supply node, waiting a time period; and

in response to the time period ending and to the power domain being electrically coupled to the power supply node, electrically coupling the chargeable device to the node of the power domain.

12. The method of implementing power gating within an integrated circuit device of claim 11 wherein electrically decoupling the chargeable device is performed prior to the node of the power domain being electrically decoupled from the power supply node in order to maintain at least a part of a charge during a low power gating period.

13. An integrated circuit device comprising at least one power gating arrangement the at least one power gating arrangement) comprising:

at least one gated power domain;

at least one power gating component coupled between at least one node of the at least one gated power domain and at least a first power supply node, the at least one power gating component being arranged to selectively couple the at least one node of the at least one gated power domain to the at least first power supply node, wherein the at least one power gating arrangement further comprises at least one isolation component operably coupled between at least one chargeable device and the at least one node of the at least one gated power domain; and

a power gating control module coupled to the at least one isolation component and to the least one power gating component, the power gating control module to electrically decouple the at least one chargeable device from the at least one node of the at least one gated power domain, to electrically couple the at least first power supply node while the at least one chargeable device is electrically de-coupled from the at least one node of the at least one gated power domain, and, after waiting for a non-zero period of time and while the at least one node of the at least one gated power domain is electrically coupled to the at least first power supply node, electrically couple the at least one chargeable device to the at least one node of the at least one gated power domain.

14. The integrated circuit device of claim 13 wherein the at least one isolation component is coupled in series between the at least one chargeable device and the at least one node of the power domain.

15. The integrated circuit device of claim 13 wherein the at least one power gating component is arranged to receive a power gating control signal at an input thereof, and to electrically couple the at least one node of the power domain to the at least one power supply node in accordance with the received power gating control signal.

16. The integrated circuit device of claim 13 wherein the at least one power gating component comprises a metal oxide semiconductor field effect transistor.

17. The integrated circuit device of claim 13 wherein the at least one isolation component is arranged to receive an isolation control signal at an input thereof, and to electrically couple the at least one chargeable device to the at least one node of the power domain in accordance with the received isolation control signal.

18. The method of claim 11 further comprising:

receiving a power gating control signal; and

electrically coupling the node of the power domain to the power supply node in accordance with the received power gating control signal.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FILING AND REMOVE APPL. NO. 14085520 REPLACE IT WITH 14086520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Mar 1, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037926/0642 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037879/0581 →
CORRECTIVE ASSIGNMENT OF INCORRECT NUMBER 14085520 PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTON OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0568 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037792/0227 →
CORRECTIVE ASSIGNMENT OF INCORRECT PATENT APPLICATION NUMBER 14085520 ,PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0454 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0390 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0399 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0420 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0790 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0493 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0577 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., COLLATERAL AGENT
Reel/Frame 032445/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2013
From: SOFER, SERGEY; NEIMAN, VALERY; PRIEL, MICHAEL
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 031680/0866 →