IP Library Granted Patent US 10,043,608
Granted Patent B2
US 10,043,608 · App. 14/131,948 · Granted Aug 7, 2018

Laminated coil component

Inventors: Takahiro Sato (Tokyo, JP); Yuya Ishima (Tokyo, JP); Shusaku Umemoto (Tokyo, JP); Takashi Suzuki (Tokyo, JP); Satoru Okamoto (Tokyo, JP); Yoshikazu Sakaguchi (Tokyo, JP)
Assignee: TDK CORPORATION
H01F5/06H01F17/0013H01F2017/004
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Quick Facts
Patent No.
US 10,043,608
App. No.
14/131,948
Granted
Aug 7, 2018
Kind
B2
Abstract

A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

Claims (11)

1. A laminated coil component comprising:

an element assembly formed by laminating a plurality of insulation layers; and

a coil unit formed inside the element assembly by a plurality of coil conductors,

wherein the element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween,

wherein the shape retention layer is made from glass-ceramic containing SrO,

wherein the coil unit arrangement layer is made from glass-ceramic and contains no SrO, whereby a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layers such that the pair of shape retention layers retain a shape of the coil unit arrangement layer when the element assembly is heated between the softening point of the coil unit arrangement layer and the softening point or the melting point of the shape retention layers, and

wherein no conductor is arranged in the shape retention layers.

2. The laminated coil component according to claim 1 ,

wherein the coil unit arrangement layer contains 86.7 weight % to 92.5 weight % of SiO 2 .

3. The laminated coil component according to claim 1 ,

wherein the coil unit arrangement layer contains 0.5 weight % to 2.4 weight % of Al 2 O 3 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2014
From: SATO, TAKAHIRO; ISHIMA, YUYA; UMEMOTO, SHUSAKU; SUZUKI, TAKASHI; OKAMOTO, SATORU; SAKAGUCHI, YOSHIKAZU
To: TDK CORPORATION
Reel/Frame 031936/0597 →
Priority Claims (3)
JP 2011-194911 · Sep 7, 2011 · national
JP 2012-045631 · Mar 1, 2012 · national
JP 2012-045635 · Mar 1, 2012 · national
Continuity (1)
Related Publication 20140145816A1 · May 29, 2014