Semiconductor device composed of AlGaInN layers with inactive regions
View Patent ↗A semiconductor device having: a substrate; a nitride semiconductor layer including a first semiconductor layer made of GaN or In x Ga 1-x N (0<x≦1) and formed on the substrate and a second semiconductor layer containing Al and formed on the first semiconductor layer; and a protective film formed on the set of nitride semiconductor layers. The nitride semiconductor layer has an active section and an inactive section surrounding the active section, and a portion of the second semiconductor layer has been removed from the inactive section.
1. A semiconductor device comprising:
a substrate;
a set of nitride semiconductor layers, including:
a first semiconductor layer made of In x Ga 1-x N (0≦x≦1) and formed on the substrate, and
a second semiconductor layer containing Al and nitrogen, and formed on the first semiconductor layer;
a third semiconductor layer made of In y Ga 1-y N (0≦y≦1) and formed on the set of nitride semiconductor layers; and
a protective film formed on the third semiconductor layer, wherein
when viewed in plan, the set of nitride semiconductor layers has an active section and an inactive section surrounding the active section, the active section being a section where channels exist, the inactive section being a section where no channels exist, and
in the inactive section, the third semiconductor layer is in contact with each of the second semiconductor layer and the protective film,
when viewed in cross-section, the third semiconductor layer is in contact with the protective film in the inactive section both in a vertical direction and in a horizontal direction,
the protective film has a first portion which is in contact with the third semiconductor layer in the vertical direction and a second portion which is in contact with the third semiconductor layer in the horizontal direction,
the first portion and the second portion of the protective film being formed in a single, continuous layer.
2. The semiconductor device of claim 1 , further comprising electrode pads, wherein when viewed in plan, the third semiconductor layer in the inactive section continuously surrounds the active section and the electrode pads.
3. The semiconductor device of claim 1 , further comprising:
an electrode being disposed in both of the active section and the inactive section, and
an electrode pad being disposed in the inactive section,
wherein the electrode is arranged in a comb-like pattern, and has some finger electrodes,
wherein the electrode pad is electrically connected to some finger electrodes.
4. The semiconductor device of claim 3 , wherein the third semiconductor layer disposed in the inactive section contains p-type impurities.
5. The semiconductor device of claim 3 , wherein the third semiconductor layer disposed in the inactive section is a p-type semiconductor.
6. The semiconductor device of claim 3 , further comprising:
a fourth semiconductor layer made of In z Ga 1-z N (0≦z≦1), containing p-type impurities, the fourth semiconductor layer being selectively formed on the active section of the set of nitride semiconductor layers,
wherein the third semiconductor layer disposed in the inactive section contains the same elements as the fourth semiconductor layer containing p-type impurities, and has the same thickness as the fourth semiconductor layer.
7. The semiconductor device of claim 3 , wherein a material of the second semiconductor layer has a greater band gap energy than a material of the first semiconductor layer has.
8. The semiconductor device of claim 3 , wherein the inactive section contains non-conductive impurities.
9. The semiconductor device of claim 3 , wherein the protective film is made of one of SiN, AlN, and BCN.