IP Library Granted Patent US 9,492,971
Granted Patent B2
US 9,492,971 · App. 14/133,965 · Granted Nov 15, 2016

Thermoplastic toughening material and related method

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Quick Facts
Patent No.
US 9,492,971
App. No.
14/133,965
Granted
Nov 15, 2016
Kind
B2
Abstract

A non-fibrous, apertured membrane comprises at least one thermoplastic polymeric material and has a discrete porous structure. The membrane is soluble in the thermoset matrix polymer of a composite material.

Claims (21)

1. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material, said method comprising the steps of:

a) dissolving polyethersulfone or polyetherimide in a solvent to form a solution of thermoplastic polymer;

b) dispersing said polyamide particles or copolyamide particles in said solution of thermoplastic polymer to form a dope solution;

c) casting said dope solution onto a substrate surface, said substrate surface being stippled to provide a plurality of discrete embossed areas;

d) removing a portion said dope solution from said substrate surface to expose said plurality of discrete embossed areas to form an openwork film of said dope solution, said openwork film having discrete openings therein which match said discrete embossed areas;

e) removing the solvent from said openwork film to form an openwork membrane comprising said polyamide particles or copolyamide particles dispersed in said polyethersulfone or polyetherimide; and

f) locating said openwork membrane on the surface of said fibrous layer to thereby locate said polyamide particles or copolyamide particles on the surface of said fibrous layer.

2. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein said solvent is removed from said openwork film by washing.

3. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein said composite material comprises a thermosetting resin selected from the group consisting of epoxy resins and bismaleimide resins.

4. A method for locating polyamide particles or copolyamide on the surface of a fibrous layer of a composite material according to claim 1 wherein said dope solution comprises an insoluble moiety selected from the group consisting of toughening particles, intumescents, pigments, mould release agents, nano-sized particles and conducting particles.

5. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 2 wherein said openwork film is washed with water to remove said solvent.

6. A method for locating polyamide articles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 3 wherein said dope solution comprises an insoluble moiety selected from the group consisting of toughening particles, intumescents, pigments, mould release agents, nano-sized particles and conducting particles.

7. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein said solvent comprises a liquid selected from the group consisting of dimethyl sulfoxide, dimethyl formamide, dimethylacetamide, N-methylpyrrolidone, tetramethylurea, gamma-butyrolactone, propylene carbonate and ethylene carbonate.

8. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 which includes the step of adding a soluble additive to said solvent, said soluble additive being selected from the group consisting of lithium chloride, potassium chloride, calcium chloride, sodium acetate and sodium dodecylsulfate.

9. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 8 wherein said soluble additive is dissolved in water prior to being added to said solvent.

10. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 9 wherein said solvent comprises N-methylpyrrolidone and soluble additive is lithium chloride.

11. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 9 wherein said solvent comprises dimethylsulfoxide and said soluble additive is calcium chloride.

12. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein said fibrous layers comprise fibers selected from the group consisting of aramid fibers, glass fibers, carbon fibers, hemp fibers and polyolefin fibers.

13. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 3 wherein said fibrous layers comprise carbon fibers.

14. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein said discrete openings in said openwork membrane make up from 5 to 50 percent of the surface area of said openwork membrane.

15. A method for locating polyamide particles or copolyamide particles on the surface of a fibrous layer of a composite material according to claim 1 wherein the areal weight of said openwork membrane is from 3 to 50 grams per square meter.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FILING AND REMOVE APPL. NO. 14085520 REPLACE IT WITH 14086520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Mar 1, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037926/0642 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037792/0227 →
CORRECTIVE ASSIGNMENT OF INCORRECT PATENT APPLICATION NUMBER 14085520 ,PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0454 →
CORRECTIVE ASSIGNMENT OF INCORRECT NUMBER 14085520 PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTON OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0568 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037879/0581 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0390 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0399 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0420 →