Semiconductor device having metal gate and manufacturing method thereof
View Patent ↗A semiconductor device having a metal gate includes a substrate having a first gate trench and a second gate trench formed thereon, a gate dielectric layer respectively formed in the first gate trench and the second gate trench, a first work function metal layer formed on the gate dielectric layer in the first gate trench and the second gate trench, a second work function metal layer respectively formed in the first gate trench and the second gate trench, and a filling metal layer formed on the second work function metal layer. An opening width of the second gate trench is larger than an opening width of the first gate trench. An upper area of the second work function metal layer in the first gate trench is wider than a lower area of the second work function metal layer in the first gate trench.
1. A semiconductor device having a metal gate comprising:
a substrate having a first gate trench and a second gate trench formed thereon, wherein an opening width of the second gate trench is larger than an opening width of the first gate trench;
a gate dielectric layer respectively formed in the first gate trench and the second gate trench;
a first work function metal layer formed on the gate dielectric layer in the first gate trench and the second gate trench;
a second work function metal layer respectively formed in the first gate trench and the second gate trench, an upper area of the second work function metal layer in the first gate trench being wider than a lower area of the second work function metal layer in the first gate trench, wherein the second work function metal layer in the first gate trench covers topmost portions of the first work function metal layer in the first gate trench, and topmost portions of the second work function metal layer in the second gate trench are coplanar with topmost portions of the first work function metal layer in the second gate trench; and
a filling metal layer formed on the second work function metal layer.
2. The semiconductor device according to claim 1 , wherein the gate dielectric layer comprises a high-K gate dielectric layer.
3. The semiconductor device according to claim 2 , wherein the high-K gate dielectric layer comprises an “U” shape or a “-” shape.
4. The semiconductor device according to claim 1 , further comprising an inter layer formed between the first work function metal layer and the gate dielectric layer, wherein the inter layer comprises a barrier layer, a strained stress layer, a tuning metal layer, or the combination thereof.
5. The semiconductor device according to claim 4 , wherein the inter layer comprises an “U” shape or a “-” shape.
6. The semiconductor device according to claim 1 , wherein the first work function metal layer comprises an “U” shape.
7. The semiconductor device according to claim 1 , wherein the second work function metal layer in the first gate trench is formed between the first work function metal layer and the filling metal layer.
8. The semiconductor device according to claim 1 , further comprising a third gate trench formed on the substrate, wherein the opening width of the second gate opening is larger than an opening width of the third gate trench, and the gate dielectric layer, the second work function metal layer, and the filling metal layer are formed in the third gate trench.