Cobalt based interconnects and methods of fabrication thereof
View Patent ↗An embodiment includes a metal interconnect structure, comprising: a dielectric layer disposed on a substrate; an opening in the dielectric layer, wherein the opening has sidewalls and exposes a conductive region of at least one of the substrate and an interconnect line; an adhesive layer, comprising manganese, disposed over the conductive region and on the sidewalls; and a fill material, comprising cobalt, within the opening and on a surface of the adhesion layer. Other embodiments are described herein.
1. A metal interconnect structure, comprising:
a dielectric layer on a substrate;
an opening in the dielectric layer, wherein the opening: (a)(i) has sidewalls, (a)(ii) extends from a top of the dielectric layer to a bottom of the dielectric layer, and (a)(iii) exposes a conductive region of at least one of the substrate and an additional interconnect structure;
an adhesion layer, comprising manganese, on: (b)(i) the conductive region and a bottom of the opening, and (b)(iii) the sidewalls; and
a fill material, comprising cobalt, within the opening and directly contacting the adhesion layer;
wherein the fill material is composed of at least 90 atomic % cobalt, and substantially fills the opening from the bottom of the opening to a top of the opening.
2. The structure of claim 1 , wherein the adhesion layer includes at least one element selected from a group consisting of silicon, nitrogen, carbon, hydrogen, and oxygen and the adhesion layer is no thicker than 50 A and no thinner than 1 A.
3. The structure of claim 1 , wherein the adhesion layer directly contacts both the conductive region and the dielectric layer.
4. The structure of claim 3 , wherein the fill material includes manganese that directly contacts the manganese included in the adhesion layer.
5. The structure of claim 1 , wherein the fill material includes at least one element selected from a group consisting of silicon and manganese.
6. The structure of claim 1 , wherein (a) the adhesion layer includes a first portion directly contacting the dielectric layer and a second portion directly contacting the conductive region, and (b) the first portion includes a higher atomic % manganese than the second portion.
7. The structure of claim 6 wherein the adhesion layer does not completely separate the conductive region from the fill material and the fill material directly contacts a portion of the conductive region.
8. The structure of claim 1 , wherein a portion of the fill material, which is centrally located within the opening, consists essentially of cobalt.
9. The structure of claim 1 comprising an additional dielectric layer formed directly on top of the adhesion layer and the fill material, the additional dielectric layer comprising manganese; wherein the fill material also includes manganese.
10. A metal interconnect structure, comprising:
a dielectric layer on a substrate;
an opening included in the dielectric layer, wherein the opening: (a)(i) has sidewalls, (a)(ii) extends from a top of the dielectric layer to a bottom of the dielectric layer, and (a)(iii), exposes a conductive region in at least one of the substrate and an additional interconnect structure,
a plug, comprising cobalt, included in the opening;
an adhesion layer, comprising manganese, on (b)(i) the conductive region and a bottom of the opening, and (b)(ii) the sidewalls; and
a fill material comprising cobalt that is on the plug, within the opening, and directly contacting the adhesion layer;
wherein the fill material is composed of at least 90 atomic % cobalt, and substantially fills the opening from the plug to a top of the opening.
11. The structure of claim 10 , wherein the adhesion layer directly contacts the plug and the dielectric.
12. The interconnect structure of claim 10 comprising an additional dielectric layer formed directly on top of the adhesion layer and the fill material, the additional dielectric layer comprising manganese; wherein the fill material also includes manganese.
13. The structure of claim 1 , wherein the conductive region includes the substrate.
14. The structure of claim 13 , wherein the conductive region includes a diffusion region.
15. The structure of claim 1 , wherein:
the top of the opening is wider than the bottom of the opening.
16. The structure of claim 1 wherein there is no seed layer between the adhesion layer and the fill material.
17. The structure of claim 10 wherein there is no seed layer between the adhesion layer and the fill material.
18. The structure of claim 1 wherein the fill material substantially fills a via, included in the opening, from a bottom portion of the via to a top portion of the via.