Semiconductor device with oxide semiconductor
A highly reliable semiconductor device including an oxide semiconductor is provided. Provided is a semiconductor device including an oxide semiconductor layer, an insulating layer in contact with the oxide semiconductor layer, a gate electrode layer overlapping with the oxide semiconductor layer, and a source electrode layer and a drain electrode layer electrically connected to the oxide semiconductor layer. The oxide semiconductor layer includes a first region having a crystal whose size is less than or equal to 10 nm and a second region which overlaps with the insulating layer with the first region provided therebetween and which includes a crystal part whose c-axis is aligned in a direction parallel to a normal vector of the surface of the oxide semiconductor layer.
1. A semiconductor device comprising:
an oxide semiconductor layer,
wherein the oxide semiconductor layer comprises a first region and a second region,
wherein the first region has a crystal whose size is less than or equal to 10 nm,
wherein the second region has a crystal part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor layer, and
wherein, in the first region, circumferentially distributed spots are observed in a nanobeam electron diffraction in which a diameter of an electron beam is 1 nmφ or more and 10 nmφ or less.
2. The semiconductor device according to claim 1 , wherein the oxide semiconductor layer comprises one of indium, gallium, and zinc.
3. The semiconductor device according to claim 1 , wherein oxide semiconductors included in each of the first region and the second region have different compositions from each other.
4. The semiconductor device according to claim 1 , wherein, in the first region, wherein a halo pattern is observed in a selected-area electron diffraction using a transmission electron microscope where a diameter of an electron beam is 300 nmφ or more.
5. The semiconductor device according to claim 1 , wherein a film density of the second region is higher than a film density of the first region.
6. A semiconductor device comprising:
an oxide semiconductor layer;
an insulating layer over the oxide semiconductor layer;
a gate electrode layer over the insulating layer, the gate electrode layer overlapping with the oxide semiconductor layer; and
a source electrode layer and a drain electrode layer each electrically connected to the oxide semiconductor layer,
wherein the oxide semiconductor layer includes a first region and a second region,
wherein the first region has a crystal whose size is less than or equal to 10 nm,
wherein the second region has a crystal part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor layer, and
wherein the first region is positioned between the insulating layer and the second region.
7. The semiconductor device according to claim 6 , wherein the oxide semiconductor layer comprises one of indium, gallium, and zinc.
8. The semiconductor device according to claim 6 , wherein oxide semiconductors included in each of the first region and the second region have different compositions from each other.
9. The semiconductor device according to claim 6 , wherein, in the first region, circumferentially distributed spots are observed in a nanobeam electron diffraction in which a diameter of an electron beam is 1 nmφ or more and 10 nmφ or less.
10. The semiconductor device according to claim 9 , wherein, in the first region, wherein a halo pattern is observed in a selected-area electron diffraction using a transmission electron microscope where a diameter of an electron beam is 300 nmφ or more.
11. The semiconductor device according to claim 6 , wherein a film density of the second region is higher than a film density of the first region.
12. A semiconductor device comprising:
a first insulating layer;
an oxide semiconductor layer over the first insulating layer;
a second insulating layer over the oxide semiconductor layer;
a gate electrode layer over the second insulating layer, the gate electrode layer overlapping with the oxide semiconductor layer; and
a source electrode layer and a drain electrode layer each electrically connected to the oxide semiconductor layer,
wherein the oxide semiconductor layer includes a first region, a second region over the first region, and a third region over the second region,
wherein each of the first region and the third region has a crystal whose size is less than or equal to 10 nm, and
wherein the second region has a crystal part whose c-axis is aligned in a direction parallel to a normal vector of a surface of the oxide semiconductor layer.
13. The semiconductor device according to claim 12 , wherein the oxide semiconductor layer comprises one of indium, gallium, and zinc.
14. The semiconductor device according to claim 12 ,
wherein oxide semiconductors included in each of the first region and the second region have different compositions from each other, and
wherein oxide semiconductors included in each of the second region and the third region each have different compositions from each other.
15. The semiconductor device according to claim 12 , wherein, in one of the first region and the third region, circumferentially distributed spots are observed in a nanobeam electron diffraction in which a diameter of an electron beam is 1 nmφ or more and 10 nmφ or less.
16. The semiconductor device according to claim 15 , wherein, in one of the first region and the third region, wherein a halo pattern is observed in a selected-area electron diffraction using a transmission electron microscope where a diameter of an electron beam is 300 nmφ or more.
17. The semiconductor device according to claim 12 , wherein a film density of the second region is higher than a film density of one of the first region and the third region.