IP Library › Granted Patent US 9,593,371
Granted Patent B2
US 9,593,371 · App. 14/142,603 · Granted Mar 14, 2017

Integrated photonic electronic sensor arrays for nucleic acid sequencing

Inventors: Xing Su (Cupertino, CA); Mark Oldham (Emerald Hills, CA)
Assignee: INTEL CORPORATION
C12Q1/6869C12Q1/6874
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Quick Facts
Patent No.
US 9,593,371
App. No.
14/142,603
Granted
Mar 14, 2017
Kind
B2
Abstract

Devices and methods for detecting, identifying, and sequencing, compounds, complexes, and molecules are described. Electronic detection is combined with optical excitation to determine the presence or identity of an analyte of interest. Embodiments of the invention additionally provide devices and methods that allow highly parallel nucleic acid sequence determination.

Claims (29)

1. A device comprising,

a substrate, having a surface, which comprises an integrated circuit chip,

an enzyme coupled to the substrate,

a photosensitizer coupled to a nucleotide and to the enzyme,

a DNA molecule coupled to the enzyme,

an array of sensors, on the substrate surface and including a first sensor that is coupled to the enzyme, which are coupled to the electronics of and individually addressable through the integrated circuit chip, and

at least four antennas on the substrate surface, adjacent the first sensor, and oriented to localize light that illuminates the substrate surface towards the first sensor;

wherein the photosensitizer is configured to communicate electrons between the photosensitizer and at least one of an electron receptor and an electron donor in response to: (a) the photosensitizer and the DNA molecule both coupling to the enzyme, and (b) the photosensitizer being exposed to localized light from the at least four antennas;

wherein the first sensor is configured to sense the electrons communicated with the photosensitizer to indicate the nucleotide is coupled to the DNA molecule.

2. The device of claim 1 , wherein a layer covers a first portion of the first sensor, but not a second portion of the first sensor, and the layer includes a dielectric.

3. The device of claim 1 , wherein (a) a first antenna of the at least four antennas is bigger than a second antenna of the at least four antennas, and (b) the first antenna is configured to harvest light of a first wavelength and the second antenna is configured to harvest light of a second wavelength unequal to the first wavelength.

4. The device of claim 1 , wherein a first antenna of the at least four antennas harvests light for both the first sensor and a second sensor included in the array of sensors.

5. The device of claim 1 , wherein the first sensor includes a surface comprising the electron acceptor and the electron acceptor includes a derivative of bipyridium.

6. The device of claim 2 , wherein (a) a first antenna of the at least four antennas is bigger than a second antenna of the at least four antennas, and (b) the first antenna is configured to harvest light of a first wavelength and the second antenna is configured to harvest light of a second wavelength unequal to the first wavelength.

7. The device of claim 6 , wherein the first antenna harvests light for both the first sensor and a second sensor included in the array of sensors.

8. The device of claim 7 , wherein the first sensor includes a surface comprising the electron acceptor and the electron acceptor includes a derivative of bipyridium.

9. The device of claim 7 , wherein the first sensor includes a surface comprising the electron acceptor.

10. The device of claim 1 , wherein the first sensor includes a surface comprising the electron acceptor.

11. The device of claim 4 , wherein:

a layer covers a first portion of a surface of the first sensor but not a second portion of the surface;

the layer includes a dielectric;

the sensor is between the surface and the substrate;

the substrate includes a long axis that defines its width;

the surface is generally parallel to the long axis.

12. The device of claim 4 , wherein:

a layer covers a first portion of a top surface of the first sensor but not a second portion of the top surface;

the top surface directly connects to a side surface of the first sensor;

the side surface is between the top surface and a bottom surface of the first sensor; and

the bottom surface is between the top surface and a bottom surface of the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2015
From: SU, XING; OLDHAM, MARK
To: INTEL CORPORATION
Reel/Frame 035705/0672 →
Continuity (1)
Related Publication 20150184237A1 · Jul 2, 2015