Insulated gate type semiconductor device and method for fabricating the same
View Patent ↗In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
1. A semiconductor device including a transistor, comprising:
a semiconductor substrate of a first conductivity type;
a first trench formed in the semiconductor substrate;
a first impurity region of a second conductive type opposite the first conductive type formed in the semiconductor substrate, wherein a depth of the first impurity region is shallower than a depth of the first trench;
a second impurity region of the first conductivity type formed in the semiconductor substrate, wherein a depth of the second impurity region is shallower than the depth of the first impurity region;
a second trench formed in the semiconductor substrate, wherein the second trench penetrates the second impurity region and reaches the first semiconductor impurity region, and wherein a depth of the second trench is shallower than a depth of the first trench;
a third impurity region of the second conductivity type formed in the first impurity region located at a bottom of the second trench, wherein an impurity concentration of the third impurity region is higher than an impurity concentration of the first impurity region;
a first insulating film formed over the second impurity region; and
a second conductive film formed in the second trench, wherein the second conductive film is electrically connected with the first, second, and third impurity regions inside of the second trench,
wherein the third impurity region is separated from the second impurity region.
2. The semiconductor device according to claim 1 , wherein the third impurity region is separated from the second impurity region via the first impurity region.
3. The semiconductor according to claim 1 , wherein a portion of a top surface of the second impurity region is exposed from the first insulating film.
4. The semiconductor device according to claim 1 , wherein the second conductive film is electrically connected with the top surface of the second impurity region outside of the second trench.