Patent Assignment
Reel/Frame 042086/0581
Merger and Change of Name
Recorded: 2017-03-24
Pages: 35
Assignors
RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Executed: 2014-04-01
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
Executed: 2014-04-01
Assignee
RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
111, NISHI YOKOTE-MACHI, TAKASAKI-SHI, GUNMA, JAPAN
Covered Properties
(13)
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Insulated Gate Type Semiconductor Device and Method for Fabricating the Same
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Aug 7, 2013
From: HITACHI TOBU SEMICONDUCTOR LTD.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 030964/0735 →
Merger
Mar 24, 2017
From: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
To: RENESAS NORTHERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 041731/0587 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Change of Address
Dec 7, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044742/0288 →