Crystal growth method and semiconductor light emitting device
View Patent ↗According to one embodiment, a crystal growth method is disclosed for growing a crystal of a nitride semiconductor on a major surface of a substrate. The major surface is provided with asperities. The method can include depositing a buffer layer on the major surface at a rate of not more than 0.1 micrometers per hour. The buffer layer includes Ga x Al 1-x N (0.1≦x<0.5) and has a thickness of not smaller than 20 nanometers and not larger than 50 nanometers. In addition, the method can include growing the crystal including a nitride semiconductor on the buffer layer at a temperature higher than a temperature of the substrate in the depositing the buffer layer.
1. A semiconductor light emitting device comprising:
a substrate having a major surface provided with asperities;
a Ga x Al 1-x N (0.1≦x<0.5) region provided directly on the major surface of the substrate;
a crystal region of a nitride semiconductor provided on the Ga x Al 1-x N (0.1≦x<0.5) region, a pit density of the crystal region being less than 200 pits per 400 μm×400 μm area; and
a light emitting portion provided on the crystal region, wherein
an average thickness of the Ga x Al 1-x N (0.1≦x<0.5) region is not smaller than 20 nanometers and not larger than 50 nanometers.
2. The device according to claim 1 , wherein
the crystal region includes:
a non-doped GaN region provided between the Ga x Al 1-x N (0.1≦x<0.5) region and the light emitting portion.
3. The device according to claim 2 , wherein
the crystal region further includes:
a n-type GaN region provided between the non-doped GaN region and the light emitting portion and including Si; and
a p-type semiconductor region provided on a side of the light emitting portion opposite to the Ga x Al 1-x N (0.1≦x<0.5) region.
4. The device according to claim 1 , wherein
the Ga x Al 1-x N (0.1≦x<0.5) region includes polycrystalline.
5. The device according to claim 1 , wherein the asperities include a protruding portion and a recessing portion, the protruding portion having a flat face,
a height of the asperities is not less than 0.5 μm and not more than 2 μm,
a width of the asperities is not less than 0.5 μm and not more than 5 μm, and
an arrangement pitch of the asperities is not less than 1 μm and not more than 8 μm.
6. The device according to claim 5 , wherein a difference between a first thickness of the Ga x Al 1-x N (0.1≦x<0.5) region on the protruding portion and a second thickness of the Ga x Al 1-x N (0.1≦x<0.5) region on the protruding portion is not more than 7 nm.
7. The device according to claim 6 , wherein the asperities covered with the Ga x Al 1-x N (0.1≦x<0.5) region are buried by the crystal region of the nitride semiconductor so as not to make a space between the crystal region and the asperities covered with the Ga x Al 1-x N (0.1≦x<0.5) region.
8. The device according to claim 1 , wherein the pit density of the crystal region is less than 60 pits per 400 μm×400 μm area.
9. The device according to claim 1 , wherein the pit density of the crystal region is less than 10 pits per 400 μm×400 μm area.
10. The device according to claim 1 , wherein
the substrate is a sapphire substrate.
11. The device according to claim 1 , wherein
the substrate includes at least one of sapphire, GaN, SiC, and ZnO.
12. The device according to claim 1 , wherein
the thickness of the Ga x Al 1-x N (0.1≦x<0.5) region is not smaller than 30 nanometers and not larger than 40 nanometers.
13. The device according to claim 1 , wherein
the asperities include a protruding portion and a recessing portion, and
a difference between a thickness of the Ga x Al 1-x N (0.1≦x<0.5) region in the protruding portion and a thickness of the Ga x Al 1-X N (0.1≦x<0.5) region in the recessing portion being not larger than 7 nanometers.
14. The device according to claim 1 , wherein
a height of each of the asperities is not less than 0.5 micrometers and not more than 2 micrometers.
15. The device according to claim 1 , wherein
a width of each of the asperities is not less than 0.5 micrometers and not more than 5 micrometers, and
an arrangement pitch of the asperities is not less than 1 micrometer and not more than 8 micrometers.