Semiconductor device
A semiconductor device includes a first base material having a first surface; a second base material having a coefficient of linear expansion different from that of the first base material, being in contact with the first base material, and having a second surface being adjacent to the first surface; and a first interconnect formed over the first and second surfaces to straddle a borderline between the first and second base materials. The cross-sectional area of the first interconnect along the borderline is greater than the cross-sectional area of at least part of a portion of the first interconnect on the first surface along a width of the first interconnect, or the cross-sectional area of at least part of a portion of the first interconnect on the second surface along the width of the first interconnect.
1. A semiconductor device comprising:
a first base material having a first surface on which a circuit is formed;
a second base material having a coefficient of linear expansion different from that of the first base material, being in contact with the first base material, and having a second surface being adjacent to the first surface and facing in a direction identical with a direction in which the first surface faces; and
a first interconnect formed over the first and second surfaces to straddle a first borderline between the first and second base materials when viewed in plan, and connected to the circuit formed on the first surface, wherein
a cross-sectional area of the first interconnect along the first borderline is greater than a cross-sectional area of at least part of a portion of the first interconnect on the first surface along a width of the first interconnect, or a cross-sectional area of at least part of a portion of the first interconnect on the second surface along the width of the first interconnect.
2. The semiconductor device of claim 1 , wherein
a width of a portion of the first interconnect on the first borderline is greater than each of a width of at least part of the portion of the first interconnect on the first surface and a width of at least part of the portion of the first interconnect on the second surface.
3. The semiconductor device of claim 1 , wherein
a thickness of a portion of the first interconnect on the first borderline is greater than each of a thickness of at least part of the portion of the first interconnect on the first surface and a thickness of at least part of the portion of the first interconnect on the second surface.
4. The semiconductor device of claim 1 , wherein
a direction of extension of a portion of the first interconnect straddling the first borderline is not orthogonal to the first borderline.
5. The semiconductor device of claim 1 , wherein
the first interconnect branches into a plurality of interconnects on the first borderline.
6. The semiconductor device of claim 1 , wherein
the first base material is a first semiconductor chip,
the second base material is an extension member located outward from a side surface of the first semiconductor chip,
an insulating protective film is provided over the first and second surfaces, and
the first interconnect is provided on the insulating protective film.
7. The semiconductor device of claim 6 , wherein
the second surface of the extension member has a recess, and
the first semiconductor chip is placed in the recess.
8. The semiconductor device of claim 6 further comprising:
a substrate having an upper surface on which the first semiconductor chip and the extension member are placed with the first and second surfaces facing upward;
a second semiconductor chip having a third surface on which a circuit is formed, and placed above the first surface of the first semiconductor chip with the third surface facing toward the first surface;
a first connection member provided between the first and second semiconductor chips so as to be electrically connected to the circuit formed on the first surface; and
an encapsulating resin provided on the upper surface of the substrate to cover a side surface of the extension member, the second surface, a side surface of the second semiconductor chip, and a surface of the second semiconductor chip opposite to the third surface.
9. The semiconductor device of claim 8 further comprising:
a first electrode provided on a portion of the first interconnect on the second surface;
a second electrode provided on the upper surface of the substrate; and
a second connection member through which the first and second electrodes are connected together and which is covered with the encapsulating resin.
10. The semiconductor device of claim 6 , wherein the extension member is an encapsulating resin body, an organic substrate, a ceramic substrate, or a glass substrate.
11. The semiconductor device of claim 6 , wherein
a second borderline is formed between the first semiconductor chip and the extension member to extend in a direction different from a direction of extension of the first borderline when viewed in plan,
a second interconnect is provided over the first and second surfaces so as to be electrically connected to the circuit formed on the first surface and to straddle the second borderline, and
a cross-sectional area of the second interconnect along the second borderline is greater than each of a cross-sectional area of at least part of a portion of the second interconnect on the first surface along a width of the second interconnect, and a cross-sectional area of at least part of a portion of the second interconnect on the second surface along the width of the second interconnect.
12. The semiconductor device of claim 1 , wherein
the first interconnect has a boundary region including a portion of the first interconnect on the first borderline, and a non-boundary region, and
a cross-sectional area of the first interconnect along the first borderline is greater than each of a cross-sectional area of a portion of the non-boundary region on the first surface along the width of the first interconnect, and a cross-sectional area of a portion of the non-boundary region on the second surface along the width of the first interconnect.
13. A semiconductor device comprising:
a first base material having a first surface on which a circuit is formed;
a second base material having a coefficient of linear expansion different from that of the first base material, being in contact with the first base material, and having a second surface being adjacent to the first surface and facing in a direction identical with a direction in which the first surface faces; and
an interconnect formed over the first and second surfaces to straddle a borderline between the first and second base materials when viewed in plan, and electrically connected to the circuit formed on the first surface, wherein
a thickness of a portion of the interconnect on the borderline is greater than a thickness of at least part of a portion of the interconnect on the first surface, or a thickness of at least part of a portion of the interconnect on the second surface.
14. A semiconductor device comprising:
a first base material having a first surface on which a circuit is formed;
a second base material having a coefficient of linear expansion different from that of the first base material, being in contact with the first base material, and having a second surface being adjacent to the first surface and facing in a direction identical with a direction in which the first surface faces; and
an interconnect formed over the first and second surfaces to straddle a borderline between the first and second base materials when viewed in plan, and electrically connected to the circuit formed on the first surface, wherein
the interconnect branches into a plurality of interconnects on the borderline.
15. The semiconductor device of claim 13 , wherein
the first base material is a first semiconductor chip,
the second base material is an extension member located outward from a side surface of the first semiconductor chip,
an insulating protective film is provided over the first and second surfaces, and
the first interconnect is provided on the insulating protective film.
16. The semiconductor device of claim 15 further comprising:
a substrate having an upper surface on which the first semiconductor chip and the extension member are placed with the first and second surfaces facing upward;
a second semiconductor chip having a third surface on which a circuit is formed, and placed above the first surface of the first semiconductor chip with the third surface facing toward the first surface;
a connection member provided between the first and second semiconductor chips so as to be electrically connected to the circuit formed on the first surface; and
an encapsulating resin provided on the upper surface of the substrate to cover a side surface of the extension member, the second surface, a side surface of the second semiconductor chip, a surface of the second semiconductor chip opposite to the third surface, and the connection member.
17. The semiconductor device of claim 14 , wherein
the first base material is a first semiconductor chip,
the second base material is an extension member located outward from a side surface of the first semiconductor chip,
an insulating protective film is provided over the first and second surfaces, and
the first interconnect is provided on the insulating protective film.
18. The semiconductor device of claim 17 further comprising:
a substrate having an upper surface on which the first semiconductor chip and the extension member are placed with the first and second surfaces facing upward;
a second semiconductor chip having a third surface on which a circuit is formed, and placed above the first surface of the first semiconductor chip with the third surface facing toward the first surface;
a connection member provided between the first and second semiconductor chips so as to be electrically connected to the circuit formed on the first surface; and
an encapsulating resin provided on the upper surface of the substrate to cover a side surface of the extension member, the second surface, a side surface of the second semiconductor chip, a surface of the second semiconductor chip opposite to the third surface, and the connection member.
19. The semiconductor device of claim 15 , wherein
the extension member is an encapsulating resin body, an organic substrate, a ceramic substrate, or a glass substrate.
20. The semiconductor device of claim 17 , wherein
the extension member is an encapsulating resin body, an organic substrate, a ceramic substrate, or a glass substrate.