Semiconductor package having multi-phase power inverter with internal temperature sensor
View Patent ↗According to an exemplary implementation, a semiconductor package includes a multi-phase power inverter having power switches and situated on a leadframe of the semiconductor package. The semiconductor package further includes a temperature sensor situated on the leadframe, where the temperature sensor is configured to generate a sensed temperature of the power switches. The semiconductor package also includes a driver circuit configured to drive the power switches of the multi-phase power inverter responsive to the sensed temperature. The temperature sensor can be on a common IC with the driver circuit. Furthermore, the semiconductor package can include an over-temperature protection circuit configured to provide over-temperature protection to the multi-phase power inverter using the sensed temperature.
1. A semiconductor package comprising:
a leadframe, wherein the leadframe comprises a thermally conductive material and a phase output strip extending from a first edge of said leadframe to a second edge of said leadframe opposite the first edge;
a multi-phase power inverter including power switches and situated on said leadframe of said semiconductor package;
a common integrated circuit (IC), wherein the common IC is separate from said multi-phase power inverter and situated on said leadframe;
a temperature sensor situated on said common IC, said temperature sensor configured to generate a sensed temperature of said power switches;
a driver circuit situated on said common IC, the driver circuit configured to drive said power switches of said multi-phase power inverter responsive to said sensed temperature;
an over-temperature protection circuit situated on said common IC, the over-temperature protection circuit configured to use said sensed temperature to provide over-temperature protection to said multi-phase power inverter using a plurality of temperature threshold values.
2. The semiconductor package of claim 1 , further comprising a control circuit, said driver circuit configured to drive said multi-phase power inverter responsive to a control signal from said control circuit.
3. The semiconductor package of claim 1 , wherein said power switches comprise U-phase, V-phase, and W-phase power switches.
4. The semiconductor package of claim 3 , wherein said U-phase, V-phase, and W-phase power switches comprise group III-V transistors.
5. The semiconductor package of claim 1 , wherein said temperature sensor and said driver circuit are situated on a common pad of said leadframe.
6. The semiconductor package of claim 1 , further comprising wirebonds connecting said driver circuit to said multi-phase power inverter.
7. The semiconductor package of claim 1 , further comprising an analog to digital converter that is configured to digitize said sensed temperature.
8. The semiconductor package of claim 1 , wherein said temperature sensor comprises a thermistor.
9. The semiconductor package of claim 1 , wherein said temperature sensor is within approximately 3 millimeters of each of said power switches.
10. The semiconductor package of claim 1 , wherein said leadframe is a power quad flat no-lead (PQFN) leadframe.
11. The semiconductor package of claim 1 , wherein said temperature sensor utilizes a diode to generate said sensed temperature.
12. A semiconductor package comprising:
a leadframe, wherein the leadframe comprises a thermally conductive material and a phase output strip extending from a first edge of said leadframe to a second edge of said leadframe opposite the first edge;
a multi-phase power inverter including power switches and situated on said leadframe of said semiconductor package;
a common integrated circuit (IC) comprising a temperature sensor that is configured to generate a sensed temperature of said power switches, wherein the common IC is separate from said multi-phase power inverter and situated on said leadframe;
said common integrated circuit configured to drive said power switches of said multi-phase power inverter responsive to said sensed temperature
an over-temperature protection circuit situated on said common IC, the over-temperature protection circuit configured to use said sensed temperature to provide over-temperature protection to said multi-phase power inverter using a plurality of temperature threshold values.
13. The semiconductor package of claim 12 , wherein said common IC is further configured to control switching of said multi-phase power inverter.
14. The semiconductor package of claim 12 , wherein said power switches comprise U-phase, V-phase, and W-phase power switches.
15. The semiconductor package of claim 14 , wherein said U-phase, V-phase, and W-phase power switches comprise group III-V transistors.
16. The semiconductor package of claim 12 , wherein said temperature sensor comprises a thermistor.
17. The semiconductor package of claim 12 , wherein said leadframe is a power quad flat no-lead (PQFN) leadframe.