Semiconductor light emitting device and method for manufacturing same
View Patent ↗According to one embodiment, the optical layer has a larger planar size than the semiconductor layer. The optical layer is transmissive to emission light of the light emitting layer. The first insulating film is provided on a side surface of the semiconductor layer continued from the first surface. The metal film includes a first reflective part covering the side surface of the semiconductor layer via the first insulating film. The metal film includes a second reflective part opposed to the optical layer in a region around the side surface of the semiconductor layer and extending from the first reflective part toward a side opposite from the side surface of the semiconductor layer.
1. A semiconductor light emitting device comprising:
a semiconductor layer having a first surface and a second surface on an opposite side from the first surface, and including a light emitting layer;
a p-side electrode provided on the semiconductor layer on the second surface side;
an n-side electrode provided on the semiconductor layer on the second surface side;
a support body provided on the second surface side and including a p-side interconnection part connected to the p-side electrode, an n-side interconnection part connected to the n-side electrode, and a resin layer provided between the p-side interconnection part and the n-side interconnection part;
an optical layer provided on the first surface side, having a larger planar size than the semiconductor layer, and being transmissive to emission light of the light emitting layer;
a first insulating film provided on a side surface of the semiconductor layer continued from the first surface; and
a metal film including a first reflective part and a second reflective part, the first reflective part provided on the first insulating film which is interposed between the first reflective part and the side surface of the semiconductor layer, the second reflective part provided below the optical layer at a region around the side surface of the semiconductor layer, the second reflective part extending toward a side surface of the device, an end of the second reflective part being aligned with the side surface of the device.
2. The device according to claim 1 , further comprising:
a second insulating film provided between the second reflective part of the metal film and the optical layer.
3. The device according to claim 1 , wherein the metal film is separated from the p-side interconnection part and the n-side interconnection part.
4. The device according to claim 1 , wherein the metal film is covered with the resin layer.
5. A semiconductor light emitting device comprising:
a semiconductor layer having a first surface and a second surface on an opposite side from the first surface, and including a light emitting layer;
a p-side electrode provided on the semiconductor layer on the second surface side;
an n-side electrode provided on the semiconductor layer on the second surface side;
a support body provided on the second surface side and including a p-side interconnection part connected to the p-side electrode, an n-side interconnection part connected to the n-side electrode, and a resin layer provided between the p-side interconnection part and the n-side interconnection part;
an optical layer provided on the first surface side, having a larger planar size than the semiconductor layer, and being transmissive to emission light of the light emitting layer;
a first insulating film provided on a side surface of the semiconductor layer continued from the first surface; and
a metal film including a first reflective part and a second reflective part, the first reflective part provided on the first insulating film which is interposed between the first reflective part and the side surface of the semiconductor layer, the second reflective part provided below the optical layer at a region around the side surface of the semiconductor layer, and extending toward a side surface of the device, wherein
the resin layer includes:
a first resin layer provided around the p-side interconnection part and around the n-side interconnection part; and
a second resin layer covering the metal film and being different from the first resin layer.
6. The device according to claim 5 , wherein
the first resin layer primarily includes epoxy resin, silicone resin, or fluororesin, and
the second resin layer primarily includes polyimide resin.
7. The device according to claim 1 , wherein the metal film includes an aluminum film.
8. The device according to claim 1 , wherein the resin layer has a light blocking property for the emission light of the light emitting layer.
9. The device according to claim 1 , further comprising:
a third insulating film provided between the first surface and the optical layer.
10. The device according to claim 1 , wherein the optical layer includes a phosphor layer including a plurality of phosphors excited by the emission light of the light emitting layer and emitting light of a wavelength different from a wavelength of the emission light of the light emitting layer, and a binder integrating the plurality of phosphors and transmitting the emission light of the light emitting layer and emission light of the phosphors.
11. The device according to claim 1 , wherein the optical layer includes a scattering layer including a plurality of scatterers scattering the emission light of the light emitting layer, and a binder integrating the plurality of scatterers and transmitting the emission light of the light emitting layer.
12. The device according to claim 1 , wherein
the semiconductor layer does not include a substrate on the first surface side, and
the optical layer is provided on the first surface side without a substrate between the optical layer and the semiconductor layer.
13. The device according to claim 1 , wherein
the p-side interconnection part includes a p-side interconnection layer connected to the p-side electrode, and a p-side metal pillar connected to the p-side interconnection layer and being thicker than the p-side interconnection layer, and
the n-side interconnection part includes an n-side interconnection layer connected to the n-side electrode, and an n-side metal pillar connected to the n-side interconnection layer and being thicker than the n-side interconnection layer.
14. The device according to claim 13 , wherein each of the p-side metal pillar and the n-side metal pillar includes an external end part juxtaposed in a same surface.
15. The device according to claim 1 , wherein a side surface of the optical layer is aligned with a side surface of the support body.
16. The device according to claim 1 , wherein the first surface, the second surface, and the side surface of the semiconductor layer are covered with an inorganic insulating film.
17. The device according to claim 1 , wherein
the metal film includes copper, and
a gold film is provided on an end surface of the second reflective part of the metal film.
18. The device according to claim 1 , wherein the second reflective part of the metal film extends in a direction along the first surface of the semiconductor layer.
19. The device according to claim 5 , wherein the second reflective part of the metal film extends in a direction along the first surface of the semiconductor layer.