Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated
A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
1. A plating apparatus comprising:
a plating bath;
an insoluble anode located in the plating bath;
a plating electric power supply being configured to apply a voltage between the insoluble anode and a member to be plated;
an anode-displacement mechanism being configured to move the insoluble anode in the plating bath and to hold the insoluble anode at a predetermined position in the plating bath;
a controller having an anode-position controller being configured to generate a control signal for controlling an action of the anode-displacement mechanism and to output the control signal to the anode-displacement mechanism;
a measurement instrument being configured to measure at least one of a current flowing through the insoluble anode and an electric potential of the insoluble anode with respect to the member to be plated while a voltage is applied from the plating electric power supply;
a circulation mechanism for circulating a plating solution in the plating bath, the circulation mechanism having a plating solution-suctioning portion, a pump, and a plating solution-ejecting portion;
a circulation controller contained in the controller, the circulation controller being configured to generate a control signal for controlling an action of the circulation mechanism and to output the control signal to the circulation mechanism;
an ejecting portion-displacement mechanism being configured to move the ejecting portion in the plating bath and to hold the ejecting portion at a predetermined position in the plating bath; and
an ejecting portion-position controller contained in the controller, the ejecting portion-position controller being configured to generate a control signal for controlling an action of the ejecting portion-displacement mechanism and to output the control signal to the ejecting portion-displacement mechanism,
wherein the ejecting portion-position controller is configured to generate the control signal for controlling an action of the ejecting portion-displacement mechanism based on a result measured by the measurement instrument,
wherein the circulation mechanism has an ejecting-volume adjusting mechanism being configured to adjust a plating solution ejecting-volume ejected from the plating solution-ejecting portion, and
wherein the circulation controller comprises an ejecting-volume controller being configured to generate a control signal for controlling an action of the ejecting-volume adjusting mechanism based on a result measured by the measurement instrument and to output the control signal to the ejecting-volume adjusting mechanism.
2. The plating apparatus according to claim 1 , wherein the controller comprises an electric-output controller being capable of generating a control signal for controlling at least one of a current and a voltage applied to the insoluble anode based on a result measured by the measurement instrument and of outputting the control signal to the plating electric power supply.
3. The plating apparatus according to claim 1 , wherein the anode-position controller is capable of generating a control signal for controlling an action of the anode-displacement mechanism based on a result measured by the measurement instrument and of outputting the control signal to the anode-displacement mechanism.
4. The plating apparatus according to claim 1 , the apparatus further comprising:
a circulation mechanism for circulating a plating solution in the plating bath, the circulation mechanism having a plating solution-suctioning portion, a pump, and a plating solution-ejecting portion;
a circulation controller contained in the controller, the circulation controller being capable of generating a control signal for controlling an action of the circulation mechanism and of outputting the control signal to the circulation mechanism;
an ejecting portion-displacement mechanism being capable of moving the ejecting portion in the plating bath and of holding the ejecting portion at a predetermined position in the plating bath; and
an ejecting portion-position controller contained in the controller, the ejecting portion-position controller being capable of generating a control signal for controlling an action of the ejecting portion-displacement mechanism and of outputting the control signal to the ejecting portion-displacement mechanism.
5. The plating apparatus according to claim 4 ,
wherein the circulation mechanism has an ejecting-volume adjusting mechanism being capable of adjusting a plating solution ejecting-volume ejected from the plating solution-ejecting portion, and
the circulation controller comprises an ejecting-volume controller being capable of generating a control signal for controlling an action of the ejecting-volume adjusting mechanism and of outputting the control signal to the ejecting-volume adjusting mechanism.
6. The plating apparatus according to claim 1 , the apparatus further comprising:
a member-displacement mechanism being capable of moving the member to be plated and of holding the member to be plated at a position in which at least a part of the member to be plated is located in the plating bath; and
a member-position controller contained in the controller, the member-position controller being capable of generating a control signal for controlling an action of the member-displacement mechanism and of outputting the control signal to the member-displacement mechanism.
7. The plating apparatus according to claim 6 , wherein the member-position controller is capable of outputting the control signal for controlling an action of the member-displacement mechanism while a voltage is applied between the insoluble anode and the member to be plated from the plating electric power supply.
8. The plating apparatus according to claim 4 , wherein the insoluble anode is such that its relative position to the plating solution-ejecting portion is managed, at least a part of the insoluble anode is located at a position from which an ejecting hole of the plating solution-ejecting portion is in view, the ejecting portion-displacement mechanism and the anode-displacement mechanism are integrated, and the ejecting portion-position controller and the anode-position controller are integrated.
9. The plating apparatus according to claim 8 , wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view has a shape of a guide being capable of guiding a plating solution ejected from the plating solution-ejecting portion to a predetermined direction.
10. The plating apparatus according to claim 8 , wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view has a shape of a structure formed of a planar member having a through-hole or a structure obtained by fabricating a planar member.
11. The plating apparatus according to claim 6 , wherein, upon a condition that the member-position controller has driven the member-displacement mechanism so that at least a part of the member to be plated is immersed in a plating solution, at least one of plural position controllers included in the controller drives at least one of displacement mechanisms, which is other than the member-displacement mechanism and is controlled by the at least one position controller, so that a component that is capable of moving in the plating bath by the at least one displacement mechanism moves in a direction proximal to the member to be plated.
12. The plating apparatus according to claim 11 , wherein, upon a condition that at least one of plural position controllers included in the controller has driven at least one of displacement mechanisms, which is other than the member-displacement mechanism and is controlled by the at least one position controller, so that a component that is capable of moving in the plating bath by the at least one displacement mechanism moves in a direction distal from the member to be plated, the member-position controller drives the member-displacement mechanism so that the member to be plated is taken out of the plating solution.