IP Library Granted Patent US 9,556,531
Granted Patent B2
US 9,556,531 · App. 14/158,181 · Granted Jan 31, 2017

Method for ultra-fast boriding

Inventors: Ali Erdemir (Naperville, IL); Vivekanand Sista (Willowbrook, IL); Ozgenur Kahvecioglu (Istanbul, TR); Osman Levent Eryilmaz (Plainfield, IL)
Assignee: UChicago Argonne, LLC
C25D11/028C25D3/66
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Quick Facts
Patent No.
US 9,556,531
App. No.
14/158,181
Granted
Jan 31, 2017
Kind
B2
Abstract

An article of manufacture and method of forming a borided material. An electrochemical cell is used to process a substrate to deposit a plurality of borided layers on the substrate. The plurality of layers are co-deposited such that a refractory metal boride layer is disposed on a substrate and a rare earth metal boride conforming layer is disposed on the refractory metal boride layer.

Claims (14)

1. A method of forming a boride material on a substrate, comprising the steps of,

providing a boriding component;

providing a substrate having a metal alloy having a first metal constituent comprising tungsten (W) and a second metal constituent comprising rhenium (Re);

disposing the substrate and the boriding component in an electrochemical bath;

establishing the electrochemical bath at a temperature of about 900°-1050° C.; and

forming a first metal constituent conforming boride layer comprising WB 4 on the substrate and a second metal constituent conforming boride layer comprising ReB 2 on the first metal constituent conforming boride layer.

2. The method of forming a boride material on a substrate of claim 1 , wherein the metal alloy consists essentially of W—Re 25% alloy.

3. A method of forming a boride material on a substrate, comprising the steps of,

providing a boriding component;

providing a substrate having a metal alloy having a first metal constituent comprising tungsten (W) and a second metal constituent comprising rhenium (Re), the metal alloy consisting essentially of W—Re 25% alloy;

disposing the substrate and the boriding component in an electrochemical bath;

establishing the electrochemical bath at a temperature of about 900°-1050° C.; and

forming a first metal constituent conforming boride layer on the substrate and a second metal constituent conforming boride layer on the first metal constituent conforming boride layer.

4. The method of claim 3 , wherein the first metal constituent conforming boride layer comprises WB 4 and the second metal constituent conforming boride layer comprises ReB 2 .

Assignments (2)
CONFIRMATORY LICENSE Recorded Nov 18, 2014
From: UCHICAGO ARGONNE, LLC
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 034468/0915 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2014
From: ERDEMIR, ALI; FERIDUN, OZGENUR KAHVECIOGLU; ERYILMAZ, OSMAN L.; SISTA, VIVEKANAND
To: UCHICAGO ARGONNE, LLC
Reel/Frame 033541/0743 →
Continuity (1)
Related Publication 20150203980A1 · Jul 23, 2015