IP Library Granted Patent US 9,356,161
Granted Patent B2
US 9,356,161 · App. 14/159,066 · Granted May 31, 2016

Semiconductor device and method of manufacturing semiconductor device

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Quick Facts
Patent No.
US 9,356,161
App. No.
14/159,066
Granted
May 31, 2016
Kind
B2
Abstract

A semiconductor device includes: a photoelectric conversion section made of semiconductor; a color filter made of an inorganic material to which a metal ion is added; and a getter film formed between the photoelectric conversion section and the color filter and configured to trap the metal ion.

Claims (24)

1. A semiconductor device comprising:

photoelectric conversion sections made of a semiconductor material;

color filters made of an inorganic material to which a metal ion is added;

a getter film formed between the photoelectric conversion sections and the color filters and configured to trap the metal ion; and

transfer sections being alternately arranged with the photoelectric conversion sections, wherein each of the photoelectric conversion sections has a first surface and an opposing second surface, wherein each of the transfer sections has a first surface and an opposing second surface, wherein each of the transfer sections has a third surface and an opposing fourth surface, wherein the first surface of each of the photoelectric conversion sections and the first surface of each of the transfer sections are in direct physical contact with the getter film, and wherein at least a portion of the third surface and the fourth surface of each of the transfer sections are in direct physical contact with the getter film.

2. The semiconductor device according to claim 1 , wherein the getter film is one of a boron-phosphor-silicate-glass (BPSG) film and a phosphor-silicate-glass (PSG) film.

3. The semiconductor device according to claim 1 , further comprising a diffusion preventive film formed between the photoelectric conversion sections and the color filters, the diffusion preventive film being configured to prevent diffusion of the metal ion.

4. The semiconductor device according to claim 3 , wherein the diffusion preventive film is one of a silicon nitride film and a silicon oxynitride film.

5. The semiconductor device according to claim 3 , further comprising a plurality of light blocking films, wherein the plurality of light blocking films is formed between the transfer sections and the diffusion preventive film.

6. The semiconductor device according to claim 1 , wherein each of the color filters has a mound-like convex section with a projection amount gradually increasing from a portion corresponding to each of the transfer sections formed adjacently to the photoelectric conversion sections.

7. The semiconductor device according to claim 1 , further comprising a plurality of light blocking films, wherein the plurality of light blocking films is formed at least partially between the plurality of transfer sections and the color filters.

8. A method of manufacturing a semiconductor device, the method comprising:

forming photoelectric conversion sections made of a semiconductor material;

forming color filters including an inorganic material to which a metal ion is added; and

forming a getter film between the photoelectric conversion sections and the color filters, the getter film being configured to trap the metal ion; and

forming transfer sections being alternately arranged with the photoelectric conversion sections, wherein each of the photoelectric conversion sections has a first surface and an opposing second surface, wherein each of the transfer sections has a first surface and an opposing second surface, wherein each of the transfer sections has a third surface and an opposing fourth surface, wherein the first surface of each of the photoelectric conversion sections and the first surface of each of the transfer sections are in direct physical contact with the getter film, and wherein at least a portion of the third surface and the fourth surface of each of the transfer sections are in direct physical contact with the getter film.

9. The method according to claim 8 , wherein in forming the color filters, each of the color filters is made by crystallizing a metal-containing silicon oxide that is generated by a hydrolysis reaction between tetraalkoxysilane and metal alkoxide.

10. The method according to claim 8 , wherein each of the color filters has a mound-like convex section with a projection amount gradually increasing from a portion corresponding to each of the transfer sections formed adjacently to the photoelectric conversion sections.

11. The method according to claim 8 , further comprising:

forming a diffusion preventive film between the photoelectric conversion sections and the color filters, the diffusion preventive film being configured to prevent diffusion of the metal ion.

12. The method according to claim 11 , further comprising:

forming a plurality of light blocking films, wherein the plurality of light blocking films is formed at least partially between transfer sections and the diffusion preventive film.

13. The method according to claim 8 , further comprising:

forming a plurality of light blocking films, wherein the plurality of light blocking films is formed at least partially between the transfer sections and the color filters.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE INCORRECT APPLICATION NUMBER 14/572221 AND REPLACE IT WITH 14/527221 PREVIOUSLY RECORDED AT REEL: 040815 FRAME: 0649. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 27, 2022
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 058875/0887 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED ON REEL 039635 FRAME 0495. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 5, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040815/0649 →
CHANGE OF NAME Recorded Aug 9, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039635/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2014
From: MIKI, TOMOKO
To: SONY CORPORATION
Reel/Frame 032092/0071 →