IP Library Assignment 040815/0649
Patent Assignment
Reel/Frame 040815/0649

Corrective Assignment to Correct the Nature of Conveyance Previously Recorded on Reel 039635 Frame 0495. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2016-12-05 Pages: 13
Assignor
SONY CORPORATION
Executed: 2016-07-14
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0017, JAPAN
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Page Programming Sequences and Assignment Schemes for a Memory Device
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Resistive Memory with a Thermally Insulating Region
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Memory Having a Plurality of Memory Cells and a Plurality of Word Lines
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Method for a Dry Exhumation Without Oxidation of a Cell and Source Line
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Memory Device with a Common Source Line Masking Circuit
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Memory Device Comprising Double Cascode Sense Amplifiers
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Memory Device Comprising Tiles with Shared Read and Write Circuits
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Memory Device with Variable Trim Parameters
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Interfacial Cap for Electrode Contacts in Memory Cell Arrays
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Method for Forming a Metal Cap in a Semiconductor Memory Device
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Conductive Bridge Memory System and Method of Manufacture Thereof
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Imaging Device and Electronic Apparatus
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Image Processing Apparatus, Image Processing Method, and Program
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Solid State Imaging Element, Production Method Thereof and Electronic Device
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Signal Processing Apparatus, Signal Processing Method, Image Pickup Element, and Imaging Apparatus
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Control Apparatus, Control Method, Cable, Electronic Apparatus, and Communication Apparatus with Increased Variation of Connection Mode
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Solid State Imaging Device, Electronic Apparatus, and Method for Manufacturing Solid State Imaging Device
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Integrated Circuit System with Non-Volatile Memory and Method of Manufacture Thereof
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Non-Volatile Memory System with Reliability Enhancement Mechanism and Method of Manufacture Thereof
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Image Processing Apparatus, Image Processing Method, Program and Electronic Apparatus
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Image Processing Apparatus, Image Processing Method, and Electronic Apparatus to Detect and Correct False Color in High Dynamic Range Imaging
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Solid-State Imaging Device, Method of Manufacturing Solid-State Imaging Device, and Electronic Apparatus
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Imaging Device, Apparatus and Method for Producing the Same and Electronic Apparatus
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Imaging Apparatus, Imaging Method, Manufacturing Apparatus, Manufacturing Method, and Electronic Apparatus
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Solid State Image Sensor, Production Method Thereof and Electronic Device
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Image-Capturing Device, Radiation Detection Apparatus, and Control Method for Image-Capturing Device
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Image Sensor, Operating Method Therefor, and Electronic Device
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Solid-State Imaging Device, Solid-State Imaging Method, and Electronic Apparatus
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Image Processing Apparatus, Image Processing Method, Solid-State Imaging Device, and Electronic Apparatus Configured to Calculate a Pixel Value of a Target Position in Accordance with a Weighted Value of Each Pixel on a Candidate Line of a Plurality of Candidate Lines
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Image Capture Device and Electronic Apparatus
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Solid-State Imaging Apparatus, Method of Manufacturing the Same, and Electronic Apparatus
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Solid State Imaging Device Having a Shared Pixel Structure and Electronic Apparatus
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Imaging Device, Signal Processing Device, and Electronic Apparatus Having Pixel Sharing Units That Include Portions of a Color Filter Arrangement
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Imaging Element and Electronic Apparatus with Improved Wiring Layer Configuration
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Solid-State Image Pickup Device and Electronic Apparatus Including a Solid-State Image Pickup Device Having High and Low Sensitivity Pixels
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Solid-State Imaging Device, Electronic Apparatus, and Inspection Apparatus
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Solid-State Imaging Apparatus, Manufacturing Method Therefor, and Electronic Apparatus
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Image Pickup Device, Method of Manufacturing Image Pickup Device, and Electronic Apparatus
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Solid-State Imaging Apparatus, Method of Manufacturing the Same, and Electronic Apparatus
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Connector Apparatus and Radio Transmission System
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Image Pickup Device and Electronic Apparatus
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Solid-State Imaging Device and Manufacturing Method Therefor, and Electronic Apparatus
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Image Sensor, Production Apparatus, Production Method, and Electronic Device
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Receiving Circuit and Transmitting Circuit, and Communication System and Communication Method
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Connector Apparatus and Wireless Transmission System
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Waveguide, Waveguide Manufacturing Method, and Wireless Transmission System
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Non-Volatile Memory System with Reset Verification Mechanism and Method of Operation Thereof
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Pixel Circuit
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Publication: US US20160163748A1
Solid State Imaging Apparatus and Electronic Device
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Publication: US US20140291791A1
Method for Fabricating a Metal High-K Gate Stack for a Buried Recessed Access Device
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Publication: US US20160204247A1
Solid-State Image Pickup Unit, Method of Manufacturing the Same, and Electronic Apparatus
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Integrated Circuit System with Non-Volatile Memory Stress Suppression and Method of Manufacture Thereof
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Solid-State Image Pickup Device, Electronic Apparatus, and Manufacturing Method Including Various Shaped Microlenses
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Solid-State Image Pickup Unit and Electronic Apparatus
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Imaging Device, Imaging Apparatus, Electronic Apparatus, Threshold Value Calculation Apparatus, and Imaging Method
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Semiconductor Device and Method of Manufacturing Semiconductor Device
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Solid-State Imaging Device, Method of Manufacturing Solid-State Imaging Device, and Electronic Apparatus
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Imaging Device, Electronic Apparatus and Imaging Method
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Solid-State Image Pickup Device and Manufacturing Method Thereof
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Solid-State Image Pickup Device and Manufacturing Method Thereof
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Image Processing Device, Imaging Device, Image Processing Method, and Program Having Different Exposure Start Times
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Solid-State Imaging Device and Electronic Apparatus Including a Photoelectric Conversion Unit Disposed Between Another Photoelectric Conversion Unit and a Photoelectric Conversion Film
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Sound System Including an Engine Sound Synthesizer
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Solid-State Imaging Device and Manufacturing Method Thereof, and Electronic Apparatus
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Solid-State Imaging Device, Manufacturing Method Thereof, Camera, and Electronic Device
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System and Method for Correlating Camera Views
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System and Method for Correlating Camera Views
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Image Processing Apparatus, Image Processing Method and Manufacturing Apparatus
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Solid-State Imaging Device, Method for Driving the Same, and Imaging Device
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Block Architecture for Vertical Memory Array
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Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 5, 2014
From: TEDROW, KERRY
To: SONY CORPORATION
Reel/Frame 032354/0409 →
Assignment of Assignor's Interest Mar 10, 2014
From: KITAGAWA, MAKOTO; KUNIHIRO, TAKAFUMI; OTSUKA, WATARU; TSUSHIMA, TOMOHITO
To: SONY CORPORATION
Reel/Frame 032389/0066 →
Assignment of Assignor's Interest Apr 7, 2014
From: JAVANIFARD, JAHANSHIR
To: SONY CORPORATION
Reel/Frame 032613/0470 →
Assignment of Assignor's Interest Apr 7, 2014
From: KITAGAWA, MAKOTO; JAVANIFARD, JAHANSHIR
To: SONY CORPORATION
Reel/Frame 032613/0252 →
Assignment of Assignor's Interest May 22, 2014
From: BALAKRISHNAN, MURALIKRISHNAN; BIAN, ZAILONG; DAMARLA, GOWRISANKAR; LI, HONGQI
To: SONY CORPORATION
Reel/Frame 032948/0449 →
Assignment of Assignor's Interest May 22, 2014
From: AKHTAR, KAMRAN; DUTTA, ASHIM; SCHRINSKY, ALEX J.; TRAPP, SHANE J.
To: SONY CORPORATION
Reel/Frame 032948/0317 →
Assignment of Assignor's Interest Dec 8, 2014
From: SUMINO, JUN; KITAGAWA, MAKOTO
To: SONY CORPORATION
Reel/Frame 034417/0717 →
Assignment of Assignor's Interest Dec 8, 2014
From: TSUKAMOTO, MASANORI
To: SONY CORPORATION
Reel/Frame 034417/0812 →
Assignment of Assignor's Interest Dec 8, 2014
From: OKUNO, JUN
To: SONY CORPORATION
Reel/Frame 034425/0039 →
Assignment of Assignor's Interest Dec 11, 2014
From: NAGAHIRO, KOJI
To: SONY CORPORATION
Reel/Frame 034609/0864 →
Assignment of Assignor's Interest Dec 15, 2014
From: MARUYAMA, SHUNSUKE
To: SONY CORPORATION
Reel/Frame 034638/0901 →
Assignment of Assignor's Interest Jan 23, 2015
From: NOJIMA, KENTA; KOTOO, KENGO; YOSHIOKA, HIROTAKA; IKEDA, KENTA
To: SONY CORPORATION
Reel/Frame 034807/0464 →
Assignment of Assignor's Interest Jan 27, 2015
From: TANAKA, HIROYUKI; KAWAMATA, DAISUKE; NAGATAKI, SHINGO; TADANO, RYUICHI
To: SONY CORPORATION
Reel/Frame 034819/0692 →
Assignment of Assignor's Interest Feb 5, 2015
From: COOK, BETH; RAMASWAMY, NIRMAL; YASUDA, SHUICHIRO; SILLS, SCOTT
To: SONY CORPORATION
Reel/Frame 034894/0565 →
Assignment of Assignor's Interest Feb 5, 2015
From: KITAGAWA, MAKOTO; LUTHRA, YOGESH
To: SONY CORPORATION
Reel/Frame 034894/0487 →
Assignment of Assignor's Interest May 27, 2015
From: IMOTO, TSUTOMU
To: SONY CORPORATION
Reel/Frame 035792/0554 →
Assignment of Assignor's Interest May 17, 2016
From: MABUCHI, KEIJI
To: SONY CORPORATION
Reel/Frame 038722/0493 →
Change of Name Aug 9, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039635/0495 →
Corrective Assignment to Correct the Remove Incorrect Application Number 14/572221 and Replace It with 14/527221 Previously Recorded at Reel: 040815 Frame: 0649. Assignor(S) Hereby Confirms the Assignment. Jan 27, 2022
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 058875/0887 →