Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus
View Patent ↗A solid-state imaging apparatus includes a semiconductor substrate in which a charge transfer section configured to transfer a charge generated in a photoelectric conversion section is formed. The semiconductor substrate includes a surface that is formed in a convex shape in an area in which the charge transfer section is formed.
1. An imaging apparatus, comprising:
a semiconductor substrate including a semiconductor area of a first conductivity type, wherein the semiconductor area of the first conductivity type includes a first surface and a second surface, the first surface having convex-shaped portions including a first convex-shaped portion and a second convex-shaped portion; and
a charge transfer section of a second conductivity type located between the first surface and the second surface of the semiconductor area of the first conductivity type,
wherein,
the charge transfer section is configured to transfer a charge generated in a photoelectric conversion section, and
a first end portion of the charge transfer section is located below the first convex-shaped portion, and a second end portion of the charge transfer section is located below the second convex-shaped portion.
2. The imaging apparatus according to claim 1 , wherein the charge transfer section is a vertical charge coupled device (CCD) configured to transfer the charge in a vertical direction.
3. The imaging apparatus according to claim 1 , wherein the charge transfer section is a read-out section configured to read out the charge of the photoelectric conversion section.
4. The imaging apparatus according to claim 1 , wherein the charge transfer section is a charge accumulation section configured to temporarily retain the charge generated in the photoelectric conversion section until the charge is read out.
5. The imaging apparatus of claim 1 , further comprising a channel section of the second conductivity type located between the first surface and the second surface of the semiconductor substrate, wherein the charge transfer section is located within the channel section.
6. The imaging apparatus of claim 1 , wherein the photoelectric conversion section is located within the semiconductor area of the first conductivity type.
7. The imaging apparatus of claim 6 , further comprising a film disposed on the convex-shaped portions of the first surface of the semiconductor substrate.
8. The imaging apparatus of claim 7 , further comprising a gate electrode disposed on at least one convex-shaped portion of the first surface of the semiconductor substrate.
9. An electronic apparatus, comprising:
at least one lens configured to receive incident light; and
an imaging apparatus configured to receive the incident light from the at least one lens, the imaging apparatus including:
a semiconductor substrate including a semiconductor area of a first conductivity type, wherein the semiconductor area of the first conductivity type includes a first surface and a second surface, the first surface having convex-shaped portions including a first convex-shaped portion and a second convex-shaped portion; and
a charge transfer section of a second conductivity type located between the first surface and the second surface of the semiconductor area of the first conductivity type,
wherein,
the charge transfer section is configured to transfer a charge generated in a photoelectric conversion section, and
a first end portion of the charge transfer section is located below the first convex-shaped portion, and a second end portion of the charge transfer section is located below the second convex-shaped portion.
10. The electronic apparatus according to claim 9 , wherein the charge transfer section is a vertical charge coupled device (CCD) configured to transfer the charge in a vertical direction.
11. The electronic apparatus according to claim 9 , wherein the charge transfer section is a read-out section configured to read out the charge of the photoelectric conversion section.
12. The electronic apparatus according to claim 9 , wherein the charge transfer section is a charge accumulation section configured to temporarily retain the charge generated in the photoelectric conversion section until the charge is read out.
13. The electronic apparatus of claim 9 , further comprising a channel section of the second conductivity type located between the first surface and the second surface of the semiconductor substrate, wherein the charge transfer section is located within the channel section.
14. The electronic apparatus of claim 9 , wherein the photoelectric conversion section is located within the semiconductor area of the first conductivity type.
15. The electronic apparatus of claim 14 , further comprising a film disposed on the convex-shaped portions of the first surface of the semiconductor substrate.
16. The electronic apparatus of claim 15 , further comprising a gate electrode disposed on at least one convex-shaped portion of the first surface of the semiconductor substrate.