Image sensor, production apparatus, production method, and electronic device
View Patent ↗Provided is an image sensor including a photoelectric conversion unit for converting a received light into an electric charge; a semiconductor substrate including the photoelectric conversion unit; and a plurality of areas each having a refractive index different from a refractive index of the semiconductor substrate formed between a surface of the semiconductor substrate on which light is incident and the photoelectric conversion unit. Also, provided are an apparatus and a method of producing the image sensor, and an electronic device including the image sensor.
1. An image sensor, comprising:
a photoelectric conversion unit for converting received light into an electric charge;
a semiconductor substrate including the photoelectric conversion unit; and
a plurality of areas each having a refractive index different from a refractive index of the semiconductor substrate formed between a light incident surface of the semiconductor substrate and the photoelectric conversion unit, wherein each of the areas has a wide area at a depth near the light incident surface of the semiconductor substrate, and has a narrow area at a depth near the photoelectric conversion unit.
2. The image sensor according to claim 1 , wherein
each of the areas has a conical shape, wherein a base of the conical shape is adjacent the light incident surface of the semiconductor substrate, and wherein a tip of the conical shape is adjacent the photoelectric conversion unit.
3. The image sensor according to claim 1 , wherein
a relationship n1<n3<n2 is satisfied where a film on the semiconductor substrate has a refractive index n1, the semiconductor substrate has a refractive index n2, and each of the areas has a refractive index n3.
4. The image sensor according to claim 1 , wherein
the semiconductor substrate is formed of silicon.
5. The image sensor according to claim 1 , wherein
the areas comprise either one of amorphous silicon, SiC, Si 3 N 3 and SiO 2 .
6. The image sensor according to claim 1 , wherein
either one of an oxide film and a nitride film is formed on the semiconductor substrate.
7. The image sensor according to claim 1 , wherein
each of the areas has a diameter of 100 nm to 300 nm and has a deepest position of 400 nm or less having a hole concentration of 1E16/cm 3 or more.
8. The image sensor according to claim 1 , wherein
the areas are formed in different sizes depending on a wavelength of light received at the photoelectric conversion unit.
9. The image sensor according to claim 1 , wherein
the areas are formed by ion implantation using either one of a tapered resist mask and a hard mask, and by laser annealing.
10. An apparatus for producing an image sensor including a photoelectric conversion unit for converting received light into an electric charge and a semiconductor substrate including the photoelectric conversion unit, comprising:
a unit for forming a plurality of areas each having a refractive index different from that of the semiconductor substrate formed between a surface of the semiconductor substrate on which light is incident and the photoelectric conversion unit, wherein each of the areas has a wide area at a depth near the light incident surface of the semiconductor substrate, and has a narrow area at a depth near the photoelectric conversion unit.
11. The production apparatus according to claim 10 , wherein
the areas are formed by ion implantation using either one of a tapered resist mask and a hard mask, and by laser annealing.
12. A method of producing an image sensor including a photoelectric conversion unit for converting received light into an electric charge and a semiconductor substrate including the photoelectric conversion unit, comprising:
forming a plurality of areas each having a refractive index different from that of the semiconductor substrate between a surface of the semiconductor substrate on which light is incident and the photoelectric conversion unit, wherein each of the areas is formed to have a wide area on a incident side, and to have a narrow area on a side adjacent the photoelectric conversion unit.
13. An electronic device, comprising:
a photoelectric conversion unit for converting received light into an electric charge;
a semiconductor substrate including the photoelectric conversion unit, and including a plurality of areas each having a refractive index different from that of the semiconductor substrate formed between a surface of the semiconductor substrate on which light is incident and the photoelectric conversion unit, wherein each of the areas has a wide area at a depth near the light incident surface of the semiconductor substrate, and has a narrow area at a depth near the photoelectric conversion unit;
an optical component for leading incident light to the photoelectric conversion unit; and
a signal processing unit for processing an output signal from the photoelectric conversion unit.