Imaging device and electronic apparatus
View Patent ↗An imaging device includes: a photoelectric conversion region that generates photovoltaic power for each pixel depending on irradiation light; and a first element isolation region that is provided between adjacent photoelectric conversion regions in a state of surrounding the photoelectric conversion region.
1. An imaging device comprising:
a first photoelectric conversion region that generates photovoltaic power for a first pixel depending on irradiation light;
a second photoelectric conversion region that generates photoelectric power for a second pixel depending on irradiation light, wherein the first and second photoelectric coversion regions are adjacent to one another; and
a first element isolation region that is provided between the first and second adjacent photoelectric conversion regions, wherein the first element isolation region surrounds perimeters of the first and second photoelectric conversion regions;
a first pixel circuit region;
a second element isolation region, wherein at least one of a portion of the first element isolation region and a portion of the second element isolation region is provided between the first photoelectric conversion region and the first pixel circuit region, and wherein at least one of the first element isolation region and the second element isolation region surrounds the first pixel circuit region.
2. The imaging device according to claim 1 ,
wherein the first and second element isolation regions are configured of a material that blocks a diffusion current.
3. The imaging device according to claim 1 ,
wherein a PN junction diode is formed in the photoelectric conversion region as a photo-sensor.
4. The imaging device according to claim 3 ,
wherein a transfer gate and floating diffusion are further formed in the photoelectric conversion region.
5. The imaging device according to claim 1 , further comprising:
a third element isolation region that extends across a first side of the first photoelectric conversion region, between the first and second element isolation regions.
6. The imaging device according to claim 5 , further comprising:
a fourth element isolation region that extends across a second side of the first photoelectric conversion region, wherein the first side is the light incident side.
7. The imaging device according to claim 6 , wherein the element isolation regions surround at least the first photoelectric conversion region.
8. The imaging device according to claim 6 , wherein the element isolation regions define volumes that surround the first photoelectric conversion region, the second photoelectric conversion region, the first pixel circuit region, and a second pixel circuit region.
9. An imaging device comprising:
a photoelectric conversion region that generates photovoltaic power for each pixel depending on irradiation light;
a first element isolation region that is provided between adjacent photoelectric conversion regions, wherein the first isolation region surrounds the photoelectric conversion region;
a second element isolation region that is provided between the photoelectric conversion region and a pixel circuit region,
wherein a PN junction diode is formed in the photoelectric conversion region as a photo-sensor,
wherein a transfer gate and floating diffusion are further formed in the photoelectric conversion region, and
wherein a photovoltaic type pixel and an accumulation type pixel are formed in the adjacent photoelectric conversion regions.
10. An electronic apparatus equipped with an imaging device,
wherein the imaging device includes:
a first photoelectric conversion region that generates photovoltaic power for a first pixel depending on irradiation light;
a second photoelectric conversion region that generates photoelectric power for a second pixel depending on irradiation light, wherein the first and second photoelectric conversion regions are adjacent to one another; and
a first element isolation region that is provided between the first and second adjacent photoelectric conversion regions, wherein the first element isolation region surrounds perimeters of the first and second photoelectric conversion regions;
a first pixel circuit region;
a second element isolation region, wherein at least one of a portion of the first element isolation region and a portion of the second element isolation region is provided between the first photoelectric conversion region and the first pixel circuit region, and wherein at least one of the first element isolation region and the second element isolation region surrounds the first pixel circuit region.