Patent Assignment
Reel/Frame 032948/0449
Assignment of Assignor's Interest
Recorded: 2014-05-22
Pages: 9
Assignors
BALAKRISHNAN, MURALIKRISHNAN
Executed: 2014-05-20
BIAN, ZAILONG
Executed: 2014-05-20
DAMARLA, GOWRISANKAR
Executed: 2014-05-20
LI, HONGQI
Executed: 2014-05-16
LU, JIN
Executed: 2014-05-16
RAMALINGAM, SHYAM
Executed: 2014-05-20
ZHU, XIAOYUN
Executed: 2014-05-16
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Method for Forming a Metal Cap in a Semiconductor Memory Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 9, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039635/0495 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded on Reel 039635 Frame 0495. Assignor(S) Hereby Confirms the Assignment.
Dec 5, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040815/0649 →
Corrective Assignment to Correct the Remove Incorrect Application Number 14/572221 and Replace It with 14/527221 Previously Recorded at Reel: 040815 Frame: 0649. Assignor(S) Hereby Confirms the Assignment.
Jan 27, 2022
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 058875/0887 →