SOLID STATE IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE
A solid state imaging device includes a lens that is formed to correspond to a light receiving section which is made up of a photoelectric conversion device formed on a semiconductor substrate, an oxide film having a dry etching processing selection ratio that is formed on the lens, and a black resist layer that is formed by a dry etching processing, after being fully applied on the oxide film.
1 . A solid state imaging device comprising:
a lens that is formed to correspond to a light receiving section which is made up of a photoelectric conversion device formed on a semiconductor substrate;
an oxide film having a dry etching processing selection ratio that is formed on the lens; and
a black resist layer that is formed by a dry etching processing, after being fully applied on the oxide film.
2 . The solid state imaging device according to claim 1 ,
wherein the black resist layer is formed by the dry etching processing so as to expose the lens.
3 . The solid state imaging device according to claim 2 ,
wherein the black resist layer is formed so as to fill up between gaps among the lenses.
4 . The solid state imaging device according to claim 1 ,
wherein the lens is a microlens.
5 . The solid state imaging device according to claim 1 ,
wherein the lens is an inner lens.
6 . The solid state imaging device according to claim 1 ,
wherein the device is a back face irradiation type.
7 . The solid state imaging device according to claim 1 ,
wherein the device is a surface irradiation type.
8 . An electronic apparatus comprising:
a solid state imaging device having
a lens that is formed to correspond to a light receiving section which is made up of a photoelectric conversion device formed on a semiconductor substrate,
an oxide film having a dry etching processing selection ratio that is formed on the lens, and
a black resist layer that is formed by a dry etching processing, after being fully applied on the oxide film;
an optical system that makes incident light incident upon the solid state imaging device; and
a signal handling circuit that handles an output signal which is output from the solid state imaging device.
9 . A method for manufacturing a solid state imaging device, the method comprising:
causing a manufacturing apparatus to
form a lens to correspond to a light receiving section which is made up of a photoelectric conversion device formed on a semiconductor substrate,
form an oxide film having a dry etching processing selection ratio on the formed lens, and
form a black resist layer by a dry etching processing, after fully applying the black resist layer on the formed oxide film.